參數(shù)資料
型號: LT1101SW
廠商: Linear Technology
文件頁數(shù): 7/16頁
文件大小: 0K
描述: IC PREC INSTRMNT-AMP SNGL 16SOIC
標準包裝: 47
放大器類型: 儀表
電路數(shù): 1
轉(zhuǎn)換速率: 0.1 V/µs
增益帶寬積: 37kHz
電流 - 輸入偏壓: 6nA
電壓 - 輸入偏移: 250µV
電流 - 電源: 94µA
電壓 - 電源,單路/雙路(±): 2.2 V ~ 36 V,±1.1 V ~ 18 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SO
包裝: 管件
其它名稱: LT1101S
15
LT1101
1101fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
.050
(1.270)
MAX
.016 – .021**
(0.406 – 0.533)
.010 – .045*
(0.254 – 1.143)
SEATING
PLANE
.040
(1.016)
MAX
.165 – .185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.305 – .335
(7.747 – 8.509)
.335 – .370
(8.509 – 9.398)
DIA
.200
(5.080)
TYP
.027 – .045
(0.686 – 1.143)
.028 – .034
(0.711 – 0.864)
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
45°TYP
H8(TO-5) 0.200 PCD 0801
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
.016 – .024
(0.406 – 0.610)
*
**
PIN 1
OBSOLETE PACKAGES
J8 0801
.014 – .026
(0.360 – 0.660)
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.125
3.175
MIN
.100
(2.54)
BSC
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0° – 15°
.005
(0.127)
MIN
.405
(10.287)
MAX
.220 – .310
(5.588 – 7.874)
12
3
4
87
65
.025
(0.635)
RAD TYP
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
.045 – .065
(1.143 – 1.651)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
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