參數(shù)資料
型號: LT111AH
廠商: LINEAR TECHNOLOGY CORP
元件分類: 運動控制電子
英文描述: Octal Buffers/Drivers With 3-State Outputs 20-SSOP 0 to 70
中文描述: COMPARATOR, 2000 uV OFFSET-MAX, 200 ns RESPONSE TIME, MBCY8
封裝: METAL CAN, TO-5, 8 PIN
文件頁數(shù): 11/12頁
文件大?。?/td> 196K
代理商: LT111AH
11
LT1117/LT1117-2.85
LT1117-3.3/LT1117-5
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
The SOT-223 is manufactured with gull wing leadform for
surface mount applications. The leads and heat sink are
solder plated and allow easy soldering using nonactive or
mildly active fluxes. The package is constructed with three
leads exiting one side of the package and one heat sink
exiting the other side, and the die attached to the heat sink
internally.
The recommended methods of soldering SOT-223 are:
vapor phase reflow and infrared reflow with preheat of
component to within 65
°
C of the solder temperature. Hand
soldering and wave soldering are not recommended since
these methods can easily damage the part with excessive
thermal gradients across the package.
Care must be exercised during surface mount to minimize
large (>30
°
C per second) thermal shock to the package.
LT1117 TA15
Dimensions in inches (millimeters) unless otherwise noted.
U
PACKAGE DESCRIPTIO
M Package
3-Lead Plastic DD Pak
(LTC DWG # 05-08-1460)
M (DD3) 1098
0.050
(1.270)
BSC
0.143–0.020
3.632–0.508
(
)
0.090 – 0.110
(2.286 – 2.794)
0.013 – 0.023
(0.330 – 0.584)
0.095 – 0.115
(2.413 – 2.921)
0.004–0.004
0.102–0.102
(
)
0.050
±
0.012
(1.270
±
0.305)
0.059
(1.499)
TYP
0.045 – 0.055
(1.143 – 1.397)
0.165 – 0.180
(4.191 – 4.572)
0.330 – 0.370
(8.382 – 9.398)
0.060
(1.524)
TYP
0.390 – 0.415
(9.906 – 10.541)
15
°
TYP
0.300
(7.620)
0.075
(1.905)
0.183
(4.648)
0.060
(1.524)
0.060
(1.524)
0.256
(6.502)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
SOLDERU
W
0.114 – 0.124
(2.90 – 3.15)
0.248 – 0.264
(6.30 – 6.71)
0.130 – 0.146
(3.30 – 3.71)
0.264 – 0.287
(6.70 – 7.30)
0.0905
(2.30)
NOM
0.033 – 0.041
(0.84 – 1.04)
0.181
(4.60)
NOM
0.024 – 0.033
(0.60 – 0.84)
0.071
(1.80)
MAX
10
°
MAX
0.012
(0.31)
MIN
0.0008 – 0.0040
(0.0203 – 0.1016)
10
°
– 16
°
0.010 – 0.014
(0.25 – 0.36)
10
°
– 16
°
ST3 (SOT-233) 1298
ST Package
3-Lead Plastic SOT-223
(LTC DWG # 05-08-1630)
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