參數(shù)資料
型號: LT1124IS8#PBF
廠商: Linear Technology
文件頁數(shù): 7/20頁
文件大?。?/td> 0K
描述: IC OPAMP DUAL PREC HS LN 8SOIC
標(biāo)準(zhǔn)包裝: 100
放大器類型: 通用
電路數(shù): 2
轉(zhuǎn)換速率: 4.5 V/µs
增益帶寬積: 12.5MHz
電流 - 輸入偏壓: 8nA
電壓 - 輸入偏移: 25µV
電流 - 電源: 2.3mA
電壓 - 電源,單路/雙路(±): ±4 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 管件
LT1124/LT1125
15
11245ff
For more information www.linear.com/LT1124
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0
°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 REV G 0212
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
.050 BSC
.030
±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
package DescripTion
N8 REV I 0711
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ±.005
(3.302 ±0.127)
.020
(0.508)
MIN
.018 ±.003
(0.457 ±0.076)
.120
(3.048)
MIN
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
(
)
1
2
3
4
8
7
6
5
.255 ±.015*
(6.477 ±0.381)
.400*
(10.160)
MAX
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
N Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
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