(408) 432-1900 ● <" />
參數(shù)資料
型號(hào): LT1195CS8#PBF
廠商: Linear Technology
文件頁數(shù): 4/12頁
文件大?。?/td> 0K
描述: IC OP-AMP LOW-PWR HI-SPEED 8SOIC
標(biāo)準(zhǔn)包裝: 100
應(yīng)用: 通用
電路數(shù): 1
轉(zhuǎn)換速率: 165 V/µs
電流 - 電源: 12mA
電流 - 輸出 / 通道: 20mA
電壓 - 電源,單路/雙路(±): 4.75 V ~ 16 V,±2.38 V ~ 8 V
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 管件
12
LT1195
1195fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
LW/TP 1002 1K REV A PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1993
U
PACKAGE DESCRIPTIO
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0502
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
N
2
3
4
N/2
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
N
12
3
N/2
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL
NOT EXCEED .006" (0.15mm)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
N8 0502
.100
(2.54)
BSC
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.020
(0.508)
MIN
.018 ± .003
(0.457 ± 0.076)
.125
(3.175)
MIN
12
3
4
87
6
5
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
.009 – .015
(0.229 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
J8 0801
.014 – .026
(0.360 – 0.660)
.015 – .060
(0.381 – 1.524)
.125
3.175
MIN
.100
(2.54)
BSC
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0° – 15°
.045 – .065
(1.143 – 1.651)
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
.200
(5.080)
MAX
.005
(0.127)
MIN
.405
(10.287)
MAX
.220 – .310
(5.588 – 7.874)
12
3
4
87
65
.025
(0.635)
RAD TYP
NOTE: LEAD DIMENSIONS APPLY TO SOLDER
DIP/PLATE OR TIN PLATE LEADS
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
OBSOLETE PACKAGE
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