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| 型號： | LT1206CR#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 4/18頁 |
| 文件大小： | 0K |
| 描述： | IC CURRNT FEEDBCK AMP 250MA 7-DD |
| 標(biāo)準(zhǔn)包裝： | 750 |
| 放大器類型： | 電流反饋 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 900 V/µs |
| -3db帶寬： | 60MHz |
| 電流 - 輸入偏壓： | 10µA |
| 電壓 - 輸入偏移： | 3000µV |
| 電流 - 電源： | 20mA |
| 電流 - 輸出 / 通道： | 1.2A |
| 電壓 - 電源，單路/雙路(±)： | 10 V ~ 30 V，±5 V ~ 15 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | TO-263-8，D²Pak（7 引線+接片），TO-263CA |
| 供應(yīng)商設(shè)備封裝： | DDPAK-7 |
| 包裝： | 帶卷 (TR) |
LT1206
12
1206fb
applicaTions inForMaTion
power plane layer either inside or on the opposite side of
the board. Although the actual thermal resistance of the
PCB material is high, the length/area ratio of the thermal
resistancebetweenthelayerissmall.Copperboardstiffen-
ers and plated through holes can also be used to spread
the heat generated by the device.
Tables 1 and 2 list thermal resistance for each package.
For the TO-220 package, thermal resistance is given for
junction-to-caseonlysincethispackageisusuallymounted
to a heat sink. Measured values of thermal resistance for
several different board sizes and copper areas are listed
for each surface mount package. All measurements were
taken in still air on 3/32" FR-4 board with 1oz copper. This
datacanbeusedasaroughguidelineinestimatingthermal
resistance.Thethermalresistanceforeachapplicationwill
beaffectedbythermalinteractionswithothercomponents
as well as board size and shape.
Table 1. R Package, 7-Lead DD
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE*
BACKSIDE
2500 sq. mm 2500 sq. mm 2500 sq. mm
25°C/W
1000 sq. mm 2500 sq. mm 2500 sq. mm
27°C/W
125 sq. mm 2500 sq. mm 2500 sq. mm
35°C/W
*Tab of device attached to topside copper.
Table 2. S8 Package, 8-Lead Plastic SO
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE*
BACKSIDE
2500 sq. mm 2500 sq. mm 2500 sq. mm
60°C/W
1000 sq. mm 2500 sq. mm 2500 sq. mm
62°C/W
225 sq. mm 2500 sq. mm 2500 sq. mm
65°C/W
100 sq. mm 2500 sq. mm 2500 sq. mm
69°C/W
100 sq. mm 1000 sq. mm 2500 sq. mm
73°C/W
100 sq. mm 225 sq. mm 2500 sq. mm
80°C/W
100 sq. mm 100 sq. mm 2500 sq. mm
83°C/W
*Pins 1 and 8 attached to topside copper.
Y Package, 7-Lead TO-220
Thermal Resistance (Junction-to-Case) = 5°C/W
N8 Package, 8-Lead DIP
Thermal Resistance (Junction-to-Ambient) = 100°C/W
Calculating Junction Temperature
The junction temperature can be calculated from the
equation:
TJ = (PD × θJA) + TA
where:
TJ = Junction Temperature
TA = Ambient Temperature
PD = Device Dissipation
θJA = Thermal Resistance (Junction-to Ambient)
As an example, calculate the junction temperature for the
circuit in Figure 7 for the N8, S8, and R packages assuming
a 70°C ambient temperature.
The device dissipation can be found by measuring the
supply currents, calculating the total dissipation, and
then subtracting the dissipation in the load and feedback
network.
PD = (39mA × 30V) – (12V)2/(2k||2k) = 1.03W
Then:
TJ = (1.03W × 100°C/W) + 70°C = 173°C
for the N8 package.
TJ = (1.03W × 65°C/W) × + 70°C = 137°C
for the S8 with 225 sq. mm topside heat sinking.
TJ = (1.03W × 35°C/W) × + 70°C = 106°C
for the R package with 100 sq. mm topside heat
sinking.
Since the maximum junction temperature is 150°C, the
N8 package is clearly unacceptable. Both the S8 and R
packages are usable.
Figure 7. Thermal Calculation Example
–
+
15V
–15V
0.01F
2k
330
2k
300pF
–12V
12V
f = 2MHz
39mA
I
1206 F07
LT1206
S/D
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