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參數(shù)資料
| 型號： | LT1469IS8-2#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP 16BIT DUAL 200MHZ 8SOIC |
| 標準包裝： | 2,500 |
| 放大器類型： | 通用 |
| 電路數(shù)： | 2 |
| 轉(zhuǎn)換速率： | 30 V/µs |
| 增益帶寬積： | 200MHz |
| 電流 - 輸入偏壓： | 10nA |
| 電壓 - 輸入偏移： | 50µV |
| 電流 - 電源： | 4.1mA |
| 電流 - 輸出 / 通道： | 22mA |
| 電壓 - 電源，單路/雙路(±)： | ±2.5 V ~ 18 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 8-SO |
| 包裝： | 帶卷 (TR) |
LT1469-2
11
14692f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(Reference LTC DWG # 05-08-1610)
DF Package
12-Lead Plastic DFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1773 Rev )
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
1
6
12
7
BOTTOM VIEW—EXPOSED PAD
2.65 ± 0.10
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
2.50 REF
3.38 ±0.10
0.200 REF
0.00 – 0.05
(DF12) DFN 0806 REV
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
0.50 BSC
3.10 ± 0.05
4.50 ± 0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45°
CHAMFER
2.65 ± 0.05
3.38 ±0.05
2.50 REF
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