Please refer to http://www.linear.com/designtools/packaging/ f" />
參數(shù)資料
型號: LT1638IDD
廠商: Linear Technology
文件頁數(shù): 6/18頁
文件大?。?/td> 0K
描述: IC OP AMP 1.2MHZ R-R IN/OUT 8DFN
標準包裝: 121
系列: Over-The-Top®
放大器類型: 通用
電路數(shù): 2
輸出類型: 滿擺幅
轉換速率: 0.4 V/µs
增益帶寬積: 1.2MHz
電流 - 輸入偏壓: 20nA
電壓 - 輸入偏移: 450µV
電流 - 電源: 205µA
電流 - 輸出 / 通道: 40mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 44 V,±1.25 V ~ 22 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-WFDFN 裸露焊盤
供應商設備封裝: 8-DFN-EP(3x3)
包裝: 管件
LT1638/LT1639
14
16389fg
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.125
TYP
2.38 0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
0.05
2.38 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 0.05
(2 SIDES)
2.10 0.05
0.50
BSC
0.70 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
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