Please refer to http://www.linear.com/designtools/packaging/ f" />
參數(shù)資料
型號(hào): LT1639IS#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 6/18頁(yè)
文件大?。?/td> 0K
描述: IC OPAMP R-R IN/OUT QUAD 14SOIC
標(biāo)準(zhǔn)包裝: 2,500
系列: Over-The-Top®
放大器類(lèi)型: 通用
電路數(shù): 4
輸出類(lèi)型: 滿(mǎn)擺幅
轉(zhuǎn)換速率: 0.4 V/µs
增益帶寬積: 1.2MHz
電流 - 輸入偏壓: 20nA
電壓 - 輸入偏移: 350µV
電流 - 電源: 205µA
電流 - 輸出 / 通道: 40mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 44 V,±1.25 V ~ 22 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SO
包裝: 帶卷 (TR)
LT1638/LT1639
14
16389fg
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.125
TYP
2.38 0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
0.05
2.38 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 0.05
(2 SIDES)
2.10 0.05
0.50
BSC
0.70 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
相關(guān)PDF資料
PDF描述
35611600029 FUSE SLOW 1.6A 440V 6.3X32MM
Y162750K0000T9R RES 50K OHM .5W .01% FOIL 2010
FTS-146-01-L-D CONN HEADER 92POS DUAL .05" T/H
57102-G08-09LF MINITEK
35615000029 FUSE SLOW 5A 440V 6.3X32MM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LT1640 制造商:LINER 制造商全稱(chēng):Linear Technology 功能描述:Negative Voltage Hot Swap Controller
LT1640AH 制造商:LINER 制造商全稱(chēng):Linear Technology 功能描述:Hot Swap Controller
LT1640AHCN8 功能描述:IC CONTRLR HOTSWAP NEGVOLT 8-DIP RoHS:否 類(lèi)別:集成電路 (IC) >> PMIC - 熱交換 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 類(lèi)型:熱交換控制器 應(yīng)用:-48V 遠(yuǎn)程電力系統(tǒng),AdvancedTCA ? 系統(tǒng),高可用性 內(nèi)部開(kāi)關(guān):無(wú) 電流限制:可調(diào) 電源電壓:11.5 V ~ 14.5 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:10-TFSOP,10-MSOP(0.118",3.00mm 寬) 供應(yīng)商設(shè)備封裝:10-MSOP 包裝:管件
LT1640AHCN8#PBF 功能描述:IC CONTRLR HOTSWAP NEGVOLT 8-DIP RoHS:是 類(lèi)別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 類(lèi)型:熱插拔開(kāi)關(guān) 應(yīng)用:通用 內(nèi)部開(kāi)關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類(lèi)型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:10-TDFN-EP(3x3) 包裝:管件
LT1640AHCS8 功能描述:IC CONTRLR HOTSWAP NEGVOLT 8SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> PMIC - 熱交換 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 類(lèi)型:熱交換控制器 應(yīng)用:-48V 遠(yuǎn)程電力系統(tǒng),AdvancedTCA ? 系統(tǒng),高可用性 內(nèi)部開(kāi)關(guān):無(wú) 電流限制:可調(diào) 電源電壓:11.5 V ~ 14.5 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:10-TFSOP,10-MSOP(0.118",3.00mm 寬) 供應(yīng)商設(shè)備封裝:10-MSOP 包裝:管件