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參數(shù)資料
| 型號： | LT1803 |
| 廠商： | Linear Technology Corporation |
| 英文描述： | Single/Dual/Quad 60MHz, 20V/us, Low Power, Rail-to-Rail Input and Output Precision Op Amps |
| 中文描述： | 單/雙/四路60MHz時，20V/us，低功耗，軌至軌輸入和輸出精密運算放大器 |
| 文件頁數(shù)： | 17/20頁 |
| 文件大小： | 279K |
| 代理商： | LT1803 |
LT6220/LT6221/LT6222
17
sn622012 622012fs
U
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698)
U
PACKAGE DESCRIPTIO
and the output of the lower path is:
+OUT = 3 (2/3 V
ICM
+ 1/3 V
OCM
) – 2
(V
ICM
– V
DIFF
/2)
= 2V
ICM
+ V
OCM
– 2V
ICM
+ V
DIFF
= V
OCM
+ V
DIFF
Note that the input common mode voltage does not appear
in the output as either a common mode or a difference
mode term. However the voltage V
OCM
does appear in the
output terms, and with the same polarity, so it sets up the
output DC level. Also, the differential input voltage V
DIFF
appears fully at both outputs with opposite polarity, giving
rise to the effective differential gain of 2. Calculations show
that using 1% resistors gives worst-case input common
mode feedthrough better than –31dB, whether looking at
the output common mode or difference mode. Consider-
ing the 6dB of gain, worst-case common mode rejection
ratio is 37dB. (Remember this is assuming 1% resistors.
Of course, this can be improved with more precise resis-
tors.) Results achieved on the bench with typical 1%
resistors showed 67dB of CMRR at low frequency and
40dB CMRR at 1MHz. Gains other than 2 can be achieved
by setting R3 =
α
(R1||R2), R5 =
α
R4 and R7 =
α
R6
where gain =
α
.
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
5
2.38
±
0.10
(2 SIDES)
1
4
8
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 1203
0.25
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.5
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
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