or 8-lead MSOP package. All packages have the V sup- " />
參數(shù)資料
型號(hào): LT1806CS6#TR
廠商: Linear Technology
文件頁數(shù): 10/28頁
文件大?。?/td> 0K
描述: IC OPAMP R-R IN/OUT SGL SOT23-6
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 140 V/µs
增益帶寬積: 325MHz
電流 - 輸入偏壓: 5µA
電壓 - 輸入偏移: 100µV
電流 - 電源: 11mA
電流 - 輸出 / 通道: 85mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 12.6 V,±1.25 V ~ 6.3 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應(yīng)商設(shè)備封裝: TSOT-23-6
包裝: 帶卷 (TR)
其它名稱: LT1806CS6TR
LT1806/LT1807
18
18067fc
or 8-lead MSOP package. All packages have the V sup-
ply pin fused to the lead frame to enhance the thermal
conductance when connecting to a ground plane or a
large metal trace. Metal trace and plated through-holes
can be used to spread the heat generated by the device
to the backside of the PC board. For example, on a 3/32"
FR-4 board with 2oz copper, a total of 660 square mil-
limeters connects to Pin 4 of LT1807 in an SO-8 package
(330 square millimeters on each side of the PC board) will
bring the thermal resistance,
θJA,toabout85°C/W.Without
extra metal trace beside the power line connecting to the
V pin to provide a heat sink, the thermal resistance will be
around 105°C/W. More information on thermal resistance
for all packages with various metal areas connecting to
the V pin is provided in Tables 1, 2 and 3.
Table 1. LT1806 6-Lead SOT-23 Package
COPPER AREA
BOARD AREA
(mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE (mm2)
270
2500
135°C/W
100
2500
145°C/W
20
2500
160°C/W
0
2500
200°C/W
Device is mounted on topside.
Table 2. LT1806/LT1807 SO-8 Package
COPPER AREA
BOARD AREA
(mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE
(mm2)
BACKSIDE
(mm2)
1100
2500
65°C/W
330
2500
85°C/W
35
2500
95°C/W
35
0
2500
100°C/W
0
2500
105°C/W
Device is mounted on topside.
APPLICATIONS INFORMATION
Table 3. LT1807 8-Lead MSOP Package
COPPER AREA
BOARD AREA
(mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE
(mm2)
BACKSIDE
(mm2)
540
2500
110°C/W
100
2500
120°C/W
100
0
2500
130°C/W
30
0
2500
135°C/W
0
2500
140°C/W
Device is mounted on topside.
Junction temperature TJ is calculated from the ambient
temperature TA and power dissipation PD as follows:
TJ = TA + (PD θJA)
The power dissipation in the IC is the function of the supply
voltage, output voltage and the load resistance. For a given
supply voltage, the worst-case power dissipation PD(MAX)
occurs at the maximum quiescent supply current and at
the output voltage which is half of either supply voltage
(or the maximum swing if it is less than 1/2 the supply
voltage). PD(MAX) is given by:
PD(MAX) = (VS IS(MAX)) + (VS/2)2/RL
Example: An LT1807 in SO-8 mounted on a 2500mm2
area of PC board without any extra heat spreading plane
connected to its V pin has a thermal resistance of
105°C/W,
θJA. Operating on ±5V supplies with both ampli-
ers simultaneously driving 50Ω loads, the worst-case
power dissipation is given by:
PD(MAX) = 2 (10 14mA) + 2 (2.5)2/50
= 0.28 + 0.25 = 0.53W
相關(guān)PDF資料
PDF描述
T12-211R-2 CIRCUIT BRKR THERMAL 2A 1POLE
NPTC171KFXC-RC CONN FEMALE 17POS .1" SMD TIN
T12-211-20 CIRCUIT BRKR THERMAL 20A 1POLE
T12-211R-5.5 CIRCUIT BRKR THERMAL 5.5A 1POLE
T12-211-8 CIRCUIT BRKR THERMAL 8A 1POLE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LT1806CS6-TRPBF 制造商:LINER 制造商全稱:Linear Technology 功能描述:325MHz, Single/Dual,Rail-to-Rail Input and Output, Low Distortion,Low Noise Precision Op Amps
LT1806CS8 功能描述:IC OPAMP R-R IN/OUT SNGL 8-SOIC RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:通用 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:0.6 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:2pA 電壓 - 輸入偏移:1000µV 電流 - 電源:85µA 電流 - 輸出 / 通道:20mA 電壓 - 電源,單路/雙路(±):1.8 V ~ 6 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:14-SOICN 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:680 (CN2011-ZH PDF) 其它名稱:MCP6L04T-E/SLCT
LT1806CS8#PBF 功能描述:IC OPAMP R-R IN/OUT SNGL 8-SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:RF/IF 差分 電路數(shù):1 輸出類型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源,單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤,CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT
LT1806CS8#TR 功能描述:IC OPAMP R-R IN/OUT SNGL 8-SOIC RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 放大器類型:通用 電路數(shù):2 輸出類型:滿擺幅 轉(zhuǎn)換速率:1.8 V/µs 增益帶寬積:6.5MHz -3db帶寬:4.5MHz 電流 - 輸入偏壓:5nA 電壓 - 輸入偏移:100µV 電流 - 電源:65µA 電流 - 輸出 / 通道:35mA 電壓 - 電源,單路/雙路(±):1.8 V ~ 5.25 V,±0.9 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP,10-MSOP(0.118",3.00mm 寬) 供應(yīng)商設(shè)備封裝:10-MSOP 包裝:管件
LT1806CS8#TRPBF 功能描述:IC OPAMP R-R IN/OUT SNGL 8-SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:通用 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:0.6 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:2pA 電壓 - 輸入偏移:1000µV 電流 - 電源:85µA 電流 - 輸出 / 通道:20mA 電壓 - 電源,單路/雙路(±):1.8 V ~ 6 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:14-SOICN 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:680 (CN2011-ZH PDF) 其它名稱:MCP6L04T-E/SLCT