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參數(shù)資料
| 型號： | LT1806CS6 |
| 元件分類： | 運算放大器 |
| 英文描述： | Voltage-Feedback Operational Amplifier |
| 中文描述： | 電壓反饋運算放大器 |
| 文件頁數(shù)： | 15/24頁 |
| 文件大?。?/td> | 314K |
| 代理商： | LT1806CS6 |
LT1806/LT1807
15
APPLICATIOU
W
U
U
imped
ance at high frequency. These devices are fabri-
cated on Linear Technology’s proprietary high speed
complementary bipolar process.
Power Dissipation
The LT1806/LT1807 amplifiers combine high speed with
large output current in a small package, so there is a need
to ensure that the die’s junction temperature does not
exceed 150
°
C. The LT1806 is housed in an SO-8 package
or a 6-lead SOT-23 package and the LT1807 is in an SO-8
or 8-lead MSOP package. All packages have the V
–
supply
pin fused to the lead frame to enhance the thermal conduc-
tance when connecting to a ground plane or a large metal
trace. Metal trace and plated through-holes can be used to
spread the heat generated by the device to the backside of
the PC board. For example, on a 3/32" FR-4 board with 2oz
copper, a total of 660 square millimeters connects to Pin4
of LT1807 in an SO-8 package (330 square millimeters on
each side of the PC board) will bring the thermal resis-
tance,
θ
JA
, to about 85
°
C/W. Without extra metal trace
beside the power line connecting to the V
–
pin to provide
a heat sink, the thermal resistance will be around 105
°
C/W.
More information on thermal resistance for all packages
with various metal areas connecting to the V
–
pin is
provided in Tables 1, 2 and 3.
Table 1. LT1806 6-Lead SOT-23 Package
COPPER AREA
TOPSIDE (mm
2
)
270
100
20
0
Device is mounted on topside.
BOARD AREA
(mm
2
)
2500
2500
2500
2500
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
135
°
C/W
145
°
C/W
160
°
C/W
200
°
C/W
Table 2. LT1806/LT1807 SO-8 Package
COPPER AREA
TOPSIDE
BACKSIDE
(mm
2
)
(mm
2
)
1100
1100
330
330
35
35
35
0
0
0
Device is mounted on topside.
BOARD AREA
(mm
2
)
2500
2500
2500
2500
2500
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
65
°
C/W
85
°
C/W
95
°
C/W
100
°
C/W
105
°
C/W
Table 3. LT1807 8-Lead MSOP Package
COPPER AREA
TOPSIDE
BACKSIDE
(mm
2
)
(mm
2
)
540
540
100
100
100
0
30
0
0
0
Device is mounted on topside.
Junction temperature T
J
is calculated from the ambient
temperature T
A
and power dissipation P
D
as follows:
T
J
= T
A
+ (P
D
θ
JA
)
The power dissipation in the IC is the function of the supply
voltage, output voltage and the load resistance. For a given
supply voltage, the worst-case power dissipation P
D(MAX)
occurs at the maximum quiescent supply current and at
the output voltage which is half of either supply voltage (or
the maximum swing if it is less than 1/2 the supply
voltage). P
D(MAX)
is given by:
P
D(MAX)
= (V
S
I
S(MAX)
) + (V
S
/2)
2
/R
L
Example: An LT1807 in SO-8 mounted on a 2500mm
2
area of PC board without any extra heat spreading plane
connected to its V
–
pin has a thermal resistance of
105
°
C/W,
θ
JA
. Operating on
±
5V supplies with both
amplifiers simultaneously driving 50
loads, the worst-
case power dissipation is given by:
P
D(MAX)
= 2 (10 14mA) + 2 (2.5)
2
/50
= 0.28 + 0.25 = 0.53W
The maximum ambient temperature that the part is
allowed to operate is:
T
A
= T
J
– (P
D(MAX)
105
°
C/W)
= 150
°
C – (0.53W 105
°
C/W) = 94
°
C
To operate the device at higher ambient temperature,
connect more metal area to the V
–
pin to reduce the
thermal resistance of the package as indicated in Table 2.
BOARD AREA
(mm
2
)
2500
2500
2500
2500
2500
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
110
°
C/W
120
°
C/W
130
°
C/W
135
°
C/W
140
°
C/W
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LT1806IS6 | Voltage-Feedback Operational Amplifier |
| LT1807CMS8 | Voltage-Feedback Operational Amplifier |
| LT1807CS8 | Voltage-Feedback Operational Amplifier |
| LT1807IMS8 | Voltage-Feedback Operational Amplifier |
| LT1807IS8 | Voltage-Feedback Operational Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LT1806CS6#PBF | 制造商:Linear Technology 功能描述:OP Amp Single GP R-R I/O 6.3V/12.6V 6-Pin TSOT-23 制造商:Linear Technology 功能描述:OP AMP RRIO 12.6VIN 325MHZ 6TSOT23 制造商:Linear Technology 功能描述:OP AMP, RRIO, 12.6VIN, 325MHZ, 6TSOT23 制造商:Linear Technology 功能描述:SC-Amps/High Speed, Cut Tape R2R In/Out L/Noise HSOA 制造商:Linear Technology 功能描述:IC, OP-AMP, 325MHZ, 125V/ us, TSOT-23-6, Op Amp Type:Low Noise, No. of Amplifiers:1, Slew Rate:125V/s, Supply Voltage Range:2.5V to 12.6V, Amplifier Case Style:TSOT-23, No. of Pins:6, Bandwidth:325MHz, Operating Temperature Max:85C, RoHS Compliant: Yes |
| LT1806CS6#PBF | 制造商:Linear Technology 功能描述:IC OP-AMP 325MHZ 125V/ TSOT-23-6 制造商:Linear Technology 功能描述:IC, OP-AMP, 325MHZ, 125V/s, TSOT-23-6 |
| LT1806CS6#TR | 功能描述:IC OPAMP R-R IN/OUT SGL SOT23-6 RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:- 放大器類型:通用 電路數(shù):2 輸出類型:滿擺幅 轉(zhuǎn)換速率:1.8 V/µs 增益帶寬積:6.5MHz -3db帶寬:4.5MHz 電流 - 輸入偏壓:5nA 電壓 - 輸入偏移:100µV 電流 - 電源:65µA 電流 - 輸出 / 通道:35mA 電壓 - 電源，單路/雙路(±):1.8 V ~ 5.25 V，±0.9 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:10-MSOP 包裝:管件 |
| LT1806CS6#TRM | 功能描述:IC OPAMP R-R IN/OUT SGL SOT23-6 RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:- 放大器類型:通用 電路數(shù):2 輸出類型:滿擺幅 轉(zhuǎn)換速率:1.8 V/µs 增益帶寬積:6.5MHz -3db帶寬:4.5MHz 電流 - 輸入偏壓:5nA 電壓 - 輸入偏移:100µV 電流 - 電源:65µA 電流 - 輸出 / 通道:35mA 電壓 - 電源，單路/雙路(±):1.8 V ~ 5.25 V，±0.9 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:10-MSOP 包裝:管件 |
| LT1806CS6#TRMPBF | 功能描述:IC OPAMP R-R IN/OUT SGL SOT23-6 RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:100 系列:- 放大器類型:通用 電路數(shù):1 輸出類型:- 轉(zhuǎn)換速率:0.2 V/µs 增益帶寬積:- -3db帶寬:- 電流 - 輸入偏壓:100pA 電壓 - 輸入偏移:30µV 電流 - 電源:380µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):±2 V ~ 18 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-SO 包裝:管件 |
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