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參數(shù)資料
| 型號： | LT1810CS8 |
| 元件分類： | 運算放大器 |
| 英文描述： | Voltage-Feedback Operational Amplifier |
| 中文描述： | 電壓反饋運算放大器 |
| 文件頁數(shù)： | 15/24頁 |
| 文件大?。?/td> | 314K |
| 代理商： | LT1810CS8 |
LT1806/LT1807
15
APPLICATIOU
W
U
U
imped
ance at high frequency. These devices are fabri-
cated on Linear Technology’s proprietary high speed
complementary bipolar process.
Power Dissipation
The LT1806/LT1807 amplifiers combine high speed with
large output current in a small package, so there is a need
to ensure that the die’s junction temperature does not
exceed 150
°
C. The LT1806 is housed in an SO-8 package
or a 6-lead SOT-23 package and the LT1807 is in an SO-8
or 8-lead MSOP package. All packages have the V
–
supply
pin fused to the lead frame to enhance the thermal conduc-
tance when connecting to a ground plane or a large metal
trace. Metal trace and plated through-holes can be used to
spread the heat generated by the device to the backside of
the PC board. For example, on a 3/32" FR-4 board with 2oz
copper, a total of 660 square millimeters connects to Pin4
of LT1807 in an SO-8 package (330 square millimeters on
each side of the PC board) will bring the thermal resis-
tance,
θ
JA
, to about 85
°
C/W. Without extra metal trace
beside the power line connecting to the V
–
pin to provide
a heat sink, the thermal resistance will be around 105
°
C/W.
More information on thermal resistance for all packages
with various metal areas connecting to the V
–
pin is
provided in Tables 1, 2 and 3.
Table 1. LT1806 6-Lead SOT-23 Package
COPPER AREA
TOPSIDE (mm
2
)
270
100
20
0
Device is mounted on topside.
BOARD AREA
(mm
2
)
2500
2500
2500
2500
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
135
°
C/W
145
°
C/W
160
°
C/W
200
°
C/W
Table 2. LT1806/LT1807 SO-8 Package
COPPER AREA
TOPSIDE
BACKSIDE
(mm
2
)
(mm
2
)
1100
1100
330
330
35
35
35
0
0
0
Device is mounted on topside.
BOARD AREA
(mm
2
)
2500
2500
2500
2500
2500
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
65
°
C/W
85
°
C/W
95
°
C/W
100
°
C/W
105
°
C/W
Table 3. LT1807 8-Lead MSOP Package
COPPER AREA
TOPSIDE
BACKSIDE
(mm
2
)
(mm
2
)
540
540
100
100
100
0
30
0
0
0
Device is mounted on topside.
Junction temperature T
J
is calculated from the ambient
temperature T
A
and power dissipation P
D
as follows:
T
J
= T
A
+ (P
D
θ
JA
)
The power dissipation in the IC is the function of the supply
voltage, output voltage and the load resistance. For a given
supply voltage, the worst-case power dissipation P
D(MAX)
occurs at the maximum quiescent supply current and at
the output voltage which is half of either supply voltage (or
the maximum swing if it is less than 1/2 the supply
voltage). P
D(MAX)
is given by:
P
D(MAX)
= (V
S
I
S(MAX)
) + (V
S
/2)
2
/R
L
Example: An LT1807 in SO-8 mounted on a 2500mm
2
area of PC board without any extra heat spreading plane
connected to its V
–
pin has a thermal resistance of
105
°
C/W,
θ
JA
. Operating on
±
5V supplies with both
amplifiers simultaneously driving 50
loads, the worst-
case power dissipation is given by:
P
D(MAX)
= 2 (10 14mA) + 2 (2.5)
2
/50
= 0.28 + 0.25 = 0.53W
The maximum ambient temperature that the part is
allowed to operate is:
T
A
= T
J
– (P
D(MAX)
105
°
C/W)
= 150
°
C – (0.53W 105
°
C/W) = 94
°
C
To operate the device at higher ambient temperature,
connect more metal area to the V
–
pin to reduce the
thermal resistance of the package as indicated in Table 2.
BOARD AREA
(mm
2
)
2500
2500
2500
2500
2500
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
110
°
C/W
120
°
C/W
130
°
C/W
135
°
C/W
140
°
C/W
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相關代理商/技術參數(shù) |
參數(shù)描述 |
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| LT1810CS8#PBF | 功能描述:IC OPAMP R-R I/O DUAL 8-SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:2,500 系列:- 放大器類型:通用 電路數(shù):4 輸出類型:- 轉換速率:0.6 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:45nA 電壓 - 輸入偏移:2000µV 電流 - 電源:1.4mA 電流 - 輸出 / 通道:40mA 電壓 - 電源，單路/雙路(±):3 V ~ 32 V，±1.5 V ~ 16 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:14-TSSOP 包裝:帶卷 (TR) 其它名稱:LM324ADTBR2G-NDLM324ADTBR2GOSTR |
| LT1810CS8#TR | 功能描述:IC OPAMP R-R I/O DUAL 8SOIC RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 放大器類型:電流檢測 電路數(shù):1 輸出類型:- 轉換速率:- 增益帶寬積:125kHz -3db帶寬:- 電流 - 輸入偏壓:- 電壓 - 輸入偏移:100µV 電流 - 電源:1.1µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:4-WFBGA，CSPBGA 供應商設備封裝:4-UCSP（2x2） 包裝:剪切帶 (CT) 其它名稱:MAX9634WERS+TCT |
| LT1810CS8#TRPBF | 功能描述:IC OPAMP R-R I/O DUAL 8-SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 放大器類型:電流檢測 電路數(shù):1 輸出類型:- 轉換速率:- 增益帶寬積:125kHz -3db帶寬:- 電流 - 輸入偏壓:- 電壓 - 輸入偏移:100µV 電流 - 電源:1.1µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:4-WFBGA，CSPBGA 供應商設備封裝:4-UCSP（2x2） 包裝:剪切帶 (CT) 其它名稱:MAX9634WERS+TCT |
| LT1810IMS8 | 功能描述:IC OPAMP R-R I/O DUAL 8MSOP RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:2,500 系列:- 放大器類型:通用 電路數(shù):2 輸出類型:滿擺幅 轉換速率:350 V/µs 增益帶寬積:180MHz -3db帶寬:320MHz 電流 - 輸入偏壓:12.5µA 電壓 - 輸入偏移:800µV 電流 - 電源:15mA 電流 - 輸出 / 通道:85mA 電壓 - 電源，單路/雙路(±):2.5 V ~ 12.6 V，±1.25 V ~ 6.3 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:8-MSOP 包裝:帶卷 (TR) |
| LT1810IMS8#PBF | 功能描述:IC OPAMP R-R I/O DUAL 8-MSOP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:2,500 系列:- 放大器類型:通用 電路數(shù):2 輸出類型:滿擺幅 轉換速率:350 V/µs 增益帶寬積:180MHz -3db帶寬:320MHz 電流 - 輸入偏壓:12.5µA 電壓 - 輸入偏移:800µV 電流 - 電源:15mA 電流 - 輸出 / 通道:85mA 電壓 - 電源，單路/雙路(±):2.5 V ~ 12.6 V，±1.25 V ~ 6.3 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:8-MSOP 包裝:帶卷 (TR) |
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