參數(shù)資料
型號(hào)： LT1W92A
廠商： Sharp Corporation
英文描述： 3030 Size, 1.1mm Thickness, MID* Type Full Color Leadless Chip LED Device
中文描述： 3030尺寸，1.1mm的厚度，的MID *型全彩無(wú)引線芯片LED裝置
文件頁(yè)數(shù)： 1/1頁(yè)
文件大小： 36K
代理商： LT1W92A
(Notice)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
(Internet)
Data for sharp's optoelectronic/power device is provided for internet.(Address http://www.sharp.co.jp/ecg/)
107
LT1W92A
Full Color Leadless Chip LED Device
LT1W92A
(Under Development)
I
Outline Dimensions
1.1
0
0.7
3.0
2.6
3
2
Colorless transparency
Black print
Recommended PWB pattern for soldering
Black print
0.4
(0.9)
(
(0.9)
1.2
1
1
0
0
Soldering area
Device center
1.2
1.2
0.5
0.5
1.Plating area
Resist
2.Pin connections
4
3.Unspecified tolerance:
±
0.2
1 Anode(Blue)
2 Anode(Yellow-green)
3 Cathode
4 Anode(Red)
3
1
2
1
2
3
4
I
Radiation Diagram
0
80
40
20
60
-20
+20
+60
+80
-40
-60
-80
0
80
100
100
40
20
60
-20
+20
+40
+60
+80
-40
-60
-80
Blue
Red
Yellow-green
X
X
[Anode]
[Cathode]
R
R
DC
0.67
0.40
0.40
Pulse
1.33
0.67
0.67
Model No.
Radiation color
Radiation material
Power dissipation
P
*1
(mW)
Forward current
I
F
(mA)
Derating factor
(mA/C)
Peak forward current
I
FM*2
(mA)
Operating temperature
T
opr
(C)
Storage temperature
T
stg
(C)
Soldering temperature
T
sol*3
(C)
Reverse voltage
V
R
(V)
(
)
LT1W92A
GaN on SiC
GaP
GaAsP on GaP
200
84
84
30
30
30
100
50
50
5
5
5
260
260
260
Blue
Yellow-green
Red
-30 to +85
-30 to +85
-30 to +85
-40 to +100
-40 to +100
-40 to +100
*1 The value is specified under the condition that either color is lightened separately.
When all diodes are lightened simultaneously, the power dissipation of each diode should be less than 30% of the value specified in this table.
*2 Duty ratio=1/10, Pulse width=0.1ms
*3 For 3s or less at the temperature of hand soldering. Temperature of reflow soldering is shown on the below page.
I
Absolute Maximum Ratings
TYP
4.4
2.1
2.0
MAX
5.6
2.8
2.8
Model No.
Lens
type
Forward voltage
V
F
(V)
λ
p
(nm)
TYP
430
565
635
I
V
(mcd)
TYP
8.1
32.0
16.0
I
F
(mA)
20
20
20
I
F
(mA)
20
20
20
I
F
(mA)
20
20
20
(MH
Z
)
V
R
(V)
4
4
4
I
R
(
μ
A)
MAX
10
10
10
C
t
(pF)
TYP
50
35
20
λ
(nm)
TYP
70
30
35
Peak emission wavelength
Luminous intensity
Spectrum radiation bandwidth
Reverse current
Page for
characteristics
diagrams
----
----
----
Terminal capacitance
(T
a
=25C)
Radiation
color
LT1W92A
1
1
1
Colorless
transparency
Blue
Yellow-green
Red
I
Electro-optical Characteristics
(Unit : mm)
(T
a
=25C)
3030 Size, 1.1mm Thickness, MID*
Type Full Color Leadless Chip
LED Device
*MID:Molded Interconnection Device
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