參數(shù)資料
型號(hào): LT6105CDCB#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 11/20頁(yè)
文件大?。?/td> 0K
描述: IC AMP CURRENT SENSE R-R 6-DFN
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 電流檢測(cè)
電路數(shù): 1
轉(zhuǎn)換速率: 2 V/µs
-3db帶寬: 100kHz
電壓 - 輸入偏移: 100µV
電流 - 電源: 240µA
電流 - 輸出 / 通道: 1mA
電壓 - 電源,單路/雙路(±): 2.85 V ~ 36 V,±1.425 V ~ 18 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 6-WFDFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 6-DFN-EP(2x3)
包裝: 帶卷 (TR)
LT6105
19
6105fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
相關(guān)PDF資料
PDF描述
RL0816T-R056-F RES 0.056 OHM 1/4W 1% 0603
TSW-145-06-S-S CONN HEADER 45POS .100" SGL GOLD
51624-XX001 R/A HDR POWERBLADE
CRCW12066R49FKEA RES 6.49 OHM 1/4W 1% 1206 SMD
TSW-146-06-S-S CONN HEADER 46POS .100" SGL GOLD
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