參數(shù)資料
型號: LT6210
廠商: Linear Technology Corporation
英文描述: LASER DIODE 650NM 5.6MM
中文描述: 單/雙可編程電源電流,居民代表輸出,電流反饋放大器
文件頁數(shù): 14/16頁
文件大小: 457K
代理商: LT6210
14
LT6210/LT6211
62101f
SW
W
–IN
4
8k
I
SET
OUT
1
5
V
2
V
+
6
SUPPLY
CURRENT
CONTROL
600
600
6210 SS
V
+
V
OUTPUT BIAS
CONTROL
+IN
3
U
PACKAGE DESCRIPTIO
U
TYPICAL APPLICATIO
The response of the cable driver with a 1MHz sinusoid is
shown in Figure 4. The circuit is capable of transmitting
a 1.5V
P-P
undistorted sinusoid to the 50
termination
resistor and has a full signal 1V
P-P
bandwidth of 50MHz.
Small signal –3dB bandwidth extends from 1kHz to
56MHz with the selected coupling capacitors.
DD Package
10-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1699)
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
2.38
±
0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 5)
0.200 REF
0.00 – 0.05
(DD10) DFN 0403
0.25
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.50
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
+
LT6210
R
SER
15
1%
249
1%
2k
1%
2.2
μ
F
154
1%
1.3k
1%
2k
1%
R
TERM
50
V
OUT
6210 F03
3V
3V
6
4
3
V
IN
1
V
A
2
5
2.2
μ
F
3300pF
NPO
V
IN
1V/DIV
V
A
1V/DIV
V
1V/DIV
200ns/DIV
6210 F04
Figure 3. 3V Cable Driver with Active Termination
Figure 4. Response of Circuit at 1MHz
相關(guān)PDF資料
PDF描述
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