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參數(shù)資料
| 型號： | LT6402IUD-6#PBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DIFF AMP/ADC DRVR 16-QFN |
| 標準包裝： | 121 |
| 放大器類型： | 差分 |
| 電路數(shù)： | 2 |
| 輸出類型： | 差分 |
| 轉換速率： | 400 V/µs |
| -3db帶寬： | 300MHz |
| 電流 - 輸入偏壓： | 5µA |
| 電壓 - 輸入偏移： | 1000µV |
| 電流 - 電源： | 30mA |
| 電流 - 輸出 / 通道： | 35mA |
| 電壓 - 電源，單路/雙路(±)： | 4 V ~ 5.5 V，±2 V ~ 2.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-WFQFN 裸露焊盤 |
| 供應商設備封裝： | 16-QFN-EP（3x3） |
| 包裝： | 管件 |
15
64026fa
LT6402-6
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45 ± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10 ± 0.05
3.50 ± 0.05
0.70 ±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
PACKAGE DESCRIPTION
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| LT6402IUD-6-TR | 制造商:LINER 制造商全稱:Linear Technology 功能描述:300MHz Low Distortion, Low Noise Differential Amplifi er/ ADC Driver (AV = 6dB) |
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