參數(shù)資料
型號(hào): LT6600IS8-20#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 3/12頁(yè)
文件大小: 0K
描述: IC AMP DIFF LP FLTR 20MHZ 8-SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 差分
電路數(shù): 1
輸出類型: 差分
電流 - 輸入偏壓: 50µA
電壓 - 輸入偏移: 10000µV
電流 - 電源: 46mA
電壓 - 電源,單路/雙路(±): 3 V ~ 11 V,±1.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 帶卷 (TR)
LT6600-20
11
66002fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
APPLICATIONS INFORMATION
Table 2. LT6600-20 SO-8 Package Thermal Resistance
COPPER AREA
TOPSIDE
(mm2)
BACKSIDE
(mm2)
BOARD AREA
(mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
1100
2500
65°C/W
330
2500
85°C/W
35
2500
95°C/W
35
0
2500
100°C/W
0
2500
105°C/W
Junction temperature, TJ, is calculated from the ambient
temperature, TA, and power dissipation, PD. The power
dissipation is the product of supply voltage, VS, and
supply current, IS. Therefore, the junction temperature
is given by:
TJ = TA + (PD θJA) = TA + (VS IS θJA)
where the supply current, IS,isafunctionofsignallevel,load
impedance, temperature and common mode voltages.
For a given supply voltage, the worst-case power dissipation
occurs when the differential input signal is maximum, the
commonmodecurrentsaremaximum(seetheApplications
Information section regarding common mode DC currents),
the load impedance is small and the ambient temperature is
maximum. To compute the junction temperature, measure
the supply current under these worst-case conditions, es-
timate the thermal resistance from Table 2, then apply the
equation for TJ. For example, using the circuit in Figure 3
with a DC differential input voltage of 250mV, a differential
output voltage of 1V, no load resistance and an ambient
temperature of 85°C, the supply current (current into Pin 3)
measures 55.5mA. Assuming a PC board layout with a
35mm2 copper trace, the
θJA is 100°C/W. The resulting
junction temperature is:
TJ = TA + (PD θJA) = 85 + (5 0.0555 100) = 113°C
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep TJ
below 150°C.
PACKAGE DESCRIPTION
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0
°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
.050 BSC
.030
±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
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