out of the lter (e
參數(shù)資料
型號(hào): LT6604CUFF-2.5#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 4/16頁(yè)
文件大小: 0K
描述: IC AMP DIFF LN DUAL 34-QFN
標(biāo)準(zhǔn)包裝: 2,500
放大器類(lèi)型: 差分
電路數(shù): 2
輸出類(lèi)型: 差分
電流 - 輸入偏壓: 15µA
電壓 - 輸入偏移: 5000µV
電流 - 電源: 28mA
電壓 - 電源,單路/雙路(±): 3 V ~ 11 V,±1.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 34-WFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 34-QFN-EP(4x7)
包裝: 帶卷 (TR)
LT6604-2.5
12
660425fa
APPLICATIONS INFORMATION
input resistors grounded, measure the total integrated noise
out of the lter (eO). With the signal source connected, set
the frequency to 100kHz and adjust the amplitude until
VIN measures 100mVP-P. Measure the output amplitude,
VOUT, and compute the passband gain A = VOUT/VIN. Now
compute the input referred integrated noise (eIN) as:
e
ee
A
IN
OS
=
() – (
)
22
Table 2 lists the typical input referred integrated noise for
various values of RIN.
Table 2. Noise Performance
PASSBAND
GAIN
RIN
INPUT REFERRED
INTEGRATED NOISE
10kHz TO 2.5MHz
INPUT REFERRED
INTEGRATED NOISE
10kHz TO 5MHz
4
402Ω
18μVRMS
23μVRMS
2
806Ω
29μVRMS
39μVRMS
1
1580Ω
51μVRMS
73μVRMS
Figure 7 is plot of the noise spectral density as a function
of frequency for an LT6604-2.5 channel with RIN = 1580Ω
using the xture of Figure 6 (the instrument noise has
been subtracted from the results).
The noise at each output is comprised of a differential
component and a common mode component. Using a
transformer or combiner to convert the differential outputs
to single-ended signal rejects the common mode noise and
gives a true measure of the S/N achievable in the system.
Conversely, if each output is measured individually and the
noise power added together, the resulting calculated noise
level will be higher than the true differential noise.
Power Dissipation
The LT6604-2.5 ampliers combine high speed with large
signal currents in a small package. There is a need to en-
sure that the die’s junction temperature does not exceed
150°C. The LT6604-2.5 has an exposed pad (pin 35) which
is connected to the negative supply (V). Connecting the
pad to a ground plane helps to dissipate the heat generated
by the chip. Metal trace and plated through-holes can be
used to spread the heat generated by the device to the
backside of the PC board.
Junction temperature, TJ, is calculated from the ambient
temperature, TA, and power dissipation, PD. The power
dissipation is the product of supply voltage, VS, and total
supply current, IS. Therefore, the junction temperature is
given by:
TJ = TA + (PD θJA) = TA + (VS IS θJA)
where the supply current, IS, is a function of signal level,
load impedance, temperature and common mode voltages.
For a given supply voltage, the worst-case power dissipation
occurs when the differential input signal is maximum, the
common mode currents are maximum (see Applications
Information regarding Common Mode DC Currents), the
load impedance is small and the ambient temperature is
maximum. To compute the junction temperature, measure
the supply current under these worst-case conditions, use
43°C/W as the package thermal resistance, then apply the
equation for TJ. For example, using the circuit in Figure 3
with DC differential input voltage of 1V, a differential
output voltage of 4V, no load resistance and an ambient
temperature of 85°C, the supply current (current into V+)
measures 37.6mA per channel. The resulting junction
temperature is: TJ = TA + (PD θJA) = 85 + (5 2 0.0376
43) = 101°C. The thermal resistance can be affected by
the amount of copper on the PCB that is connected to V.
The thermal resistance of the circuit can increase if the
Exposed Pad is not connected to a large ground plane
with a number of vias.
FREQUENCY (MHz)
0.01
0
30
40
50
0.1
1
10
660425 F07
20
10
0
60
80
100
40
20
NOISE
SPECTRAL
DENSIT
Y
(nV
RMS
/√
Hz
)
INTEGRA
TED
NOISE
V
RMS
)
SPECTRAL DENSITY
INTEGRATED
Figure 7. Input Referred Noise, Gain = 1
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