參數(shù)資料
型號: LT6604IUFF-2.5#PBF
廠商: Linear Technology
文件頁數(shù): 7/16頁
文件大?。?/td> 0K
描述: IC AMP DIFF LN DUAL 34-QFN
標準包裝: 52
放大器類型: 差分
電路數(shù): 2
輸出類型: 差分
電流 - 輸入偏壓: 15µA
電壓 - 輸入偏移: 5000µV
電流 - 電源: 28mA
電壓 - 電源,單路/雙路(±): 3 V ~ 11 V,±1.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 34-WFQFN 裸露焊盤
供應商設備封裝: 34-QFN-EP(4x7)
包裝: 管件
產(chǎn)品目錄頁面: 1322 (CN2011-ZH PDF)
LT6604-2.5
15
660425fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4.00
± 0.10
1.50 REF
7.00
± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
34
33
1
2
BOTTOM VIEW—EXPOSED PAD
6.00 REF
0.75
± 0.05
R = 0.125
TYP
R = 0.10
TYP
PIN 1 NOTCH
R = 0.30 OR
0.25
× 45°
CHAMFER
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFF34) QFN 0807 REV
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
± 0.05
0.25
± 0.05
0.50 BSC
1.50 REF
6.00 REF
6.10
± 0.05
7.50
± 0.05
3.10
± 0.05
4.50
± 0.05
PACKAGE OUTLINE
2.64
± 0.10
1.47
± 0.10
1.90
± 0.10
1.83
± 0.10
1.90
± 0.10
0.99
± 0.10
2.64
± 0.05
1.47
± 0.05
1.90
± 0.05
1.90
± 0.05
1.29
± 0.05
1.83
± 0.05
PACKAGE DESCRIPTION
UFF Package
34-Lead Plastic QFN (4mm
× 7mm)
(Reference LTC DWG # 05-08-1758 Rev )
相關PDF資料
PDF描述
LT6604IUFF-5#PBF IC AMP DIFF LN DUAL 34-QFN
RNCP0805FTD24K3 RES 24.3K OHM 1/4W 1% 0805 SMD
02CM200.Z FUSE 600V 200A HRCII-C BRIT DIM
02CM125.Z FUSE 600V 125A HRCII-C BRIT DIM
RNCP0805FTD4K32 RES 4.32K OHM 1/4W 1% 0805 SMD
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