參數(shù)資料
型號(hào): LT6604IUFF-5#PBF
廠商: Linear Technology
文件頁數(shù): 7/16頁
文件大小: 0K
描述: IC AMP DIFF LN DUAL 34-QFN
標(biāo)準(zhǔn)包裝: 52
放大器類型: 差分
電路數(shù): 2
輸出類型: 差分
電流 - 輸入偏壓: 30µA
電壓 - 輸入偏移: 8000µV
電流 - 電源: 30mA
電壓 - 電源,單路/雙路(±): 3 V ~ 11 V,±1.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 34-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 34-QFN-EP(4x7)
包裝: 管件
產(chǎn)品目錄頁面: 1322 (CN2011-ZH PDF)
LT6604-5
15
66045fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
4.00
± 0.10
1.50 REF
7.00
± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
34
33
1
2
BOTTOM VIEW—EXPOSED PAD
6.00 REF
0.75
± 0.05
R = 0.125
TYP
R = 0.10
TYP
PIN 1 NOTCH
R = 0.30 OR
0.25
× 45°
CHAMFER
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFF34) QFN 0807 REV
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
± 0.05
0.25
± 0.05
0.50 BSC
1.50 REF
6.00 REF
6.10
± 0.05
7.50
± 0.05
3.10
± 0.05
4.50
± 0.05
PACKAGE OUTLINE
2.64
± 0.10
1.47
± 0.10
1.90
± 0.10
1.83
± 0.10
1.90
± 0.10
0.99
± 0.10
2.64
± 0.05
1.47
± 0.05
1.90
± 0.05
1.90
± 0.05
1.29
± 0.05
1.83
± 0.05
UFF Package
34-Lead Plastic QFN (4mm
× 7mm)
(Reference LTC DWG # 05-08-1758 Rev )
相關(guān)PDF資料
PDF描述
RNCP0805FTD24K3 RES 24.3K OHM 1/4W 1% 0805 SMD
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RNCP0805FTD4K32 RES 4.32K OHM 1/4W 1% 0805 SMD
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