參數(shù)資料
型號： LTC1051CSW#TR
廠商： Linear Technology
文件頁數(shù)： 7/16頁
文件大小： 0K
描述： IC OPAMP CHOP STABLE DUAL 16SOIC
標準包裝： 1,000
放大器類型： 斷路器（零漂移）
電路數(shù)： 2
轉(zhuǎn)換速率： 4 V/µs
增益帶寬積： 2.5MHz
電流 - 輸入偏壓： 15pA
電壓 - 輸入偏移： 0.5µV
電流 - 電源： 1mA
電壓 - 電源，單路/雙路(±)： 4.75 V ~ 16 V，±2.38 V ~ 8 V
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 16-SOIC（0.295"，7.50mm 寬）
供應商設(shè)備封裝： 16-SO
包裝： 帶卷 (TR)
15
LTC1051/LTC1053
10513fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S18 (WIDE) 0502
NOTE 3
.447 – .463
(11.354 – 11.760)
NOTE 4
15
14
13
12
11
10
16
9
N/2
1
23
4
5
6
78
.394 – .419
(10.007 – 10.643)
17
18
N
.037 – .045
(0.940 – 1.143)
.004 – .012
(0.102 – 0.305)
.093 – .104
(2.362 – 2.642)
.050
(1.270)
BSC
.014 – .019
(0.356 – 0.482)
TYP
0° – 8° TYP
NOTE 3
.009 – .013
(0.229 – 0.330)
.016 – .050
(0.406 – 1.270)
.291 – .299
(7.391 – 7.595)
NOTE 4
× 45°
.010 – .029
(0.254 – 0.737)
.420
MIN
.325 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
N
12
3
N/2
.050 BSC
.030 ±.005
TYP
.005
(0.127)
RAD MIN
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES
ON THE BOTTOM OF PACKAGES ARE THE
MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR
WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED .006" (0.15mm)
S16 (WIDE) 0502
NOTE 3
.398 – .413
(10.109 – 10.490)
NOTE 4
16
15
14
13
12
11
10
9
1
N
23
4
5
6
78
N/2
.394 – .419
(10.007 – 10.643)
.037 – .045
(0.940 – 1.143)
.004 – .012
(0.102 – 0.305)
.093 – .104
(2.362 – 2.642)
.050
(1.270)
BSC
.014 – .019
(0.356 – 0.482)
TYP
0° – 8° TYP
NOTE 3
.009 – .013
(0.229 – 0.330)
.005
(0.127)
RAD MIN
.016 – .050
(0.406 – 1.270)
.291 – .299
(7.391 – 7.595)
NOTE 4
× 45°
.010 – .029
(0.254 – 0.737)
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES
ON THE BOTTOM OF PACKAGES ARE THE
MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR
WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED .006" (0.15mm)
.420
MIN
.325 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
N
12
3
N/2
.050 BSC
.030 ±.005
TYP
SW Package
16-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
SW Package
18-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
U
PACKAGE DESCRIPTIO
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