參數(shù)資料
型號: LTC1099ACN#PBF
廠商: Linear Technology
文件頁數(shù): 7/16頁
文件大?。?/td> 0K
描述: IC A/D CONV 8BIT HI-SPEED 20-DIP
標準包裝: 18
位數(shù): 8
采樣率(每秒): 400k
數(shù)據(jù)接口: 并聯(lián)
轉換器數(shù)目: 3
功率耗散(最大): 55mW
電壓電源: 單電源
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 20-DIP(0.300",7.62mm)
供應商設備封裝: 20-PDIP
包裝: 管件
輸入數(shù)目和類型: 1 個單端,單極
LTC1099
15
PACKAGE DESCRIPTIO
U
Dimensions in inches (millimeters) unless otherwise noted.
N20 1098
0.020
(0.508)
MIN
0.125
(3.175)
MIN
0.130
± 0.005
(3.302
± 0.127)
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.018
± 0.003
(0.457
± 0.076)
0.005
(0.127)
MIN
0.100
(2.54)
BSC
0.255
± 0.015*
(6.477
± 0.381)
1.040*
(26.416)
MAX
12
3
4
5
6
7
8
910
19
11
12
13
14
16
15
17
18
20
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.035
–0.015
+0.889
–0.381
8.255
()
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
N Package
20-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
S20 (WIDE) 1098
NOTE 1
0.496 – 0.512*
(12.598 – 13.005)
20
19
18
17
16
15
14
13
1
23
4
5
6
78
0.394 – 0.419
(10.007 – 10.643)
910
11
12
0.037 – 0.045
(0.940 – 1.143)
0.004 – 0.012
(0.102 – 0.305)
0.093 – 0.104
(2.362 – 2.642)
0.050
(1.270)
BSC
0.014 – 0.019
(0.356 – 0.482)
TYP
0
° – 8° TYP
NOTE 1
0.009 – 0.013
(0.229 – 0.330)
0.016 – 0.050
(0.406 – 1.270)
0.291 – 0.299**
(7.391 – 7.595)
× 45°
0.010 – 0.029
(0.254 – 0.737)
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
*
**
SW Package
20-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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