參數(shù)資料
型號： LTC1100CSW#PBF
廠商： Linear Technology
文件頁數(shù)： 8/8頁
文件大小： 0K
描述： IC INSTRMNT AMP CHOP-STBL 16SOIC
標準包裝： 47
系列： LTCMOS™
放大器類型： 斷路器（零漂移）
電路數(shù)： 1
增益帶寬積： 18kHz
電流 - 輸入偏壓： 2.5pA
電壓 - 輸入偏移： 1µV
電流 - 電源： 2.4mA
電壓 - 電源，單路/雙路(±)： 5 V ~ 16 V，±2.5 V ~ 8 V
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 16-SOIC（0.295"，7.50mm 寬）
供應商設備封裝： 16-SO
包裝： 管件
產(chǎn)品目錄頁面： 1323 (CN2011-ZH PDF)
LTC1100
8
1100fc
LW/TP 1202 1K REV C PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1994
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com
J8 0801
.014 – .026
(0.360 – 0.660)
.015 – .060
(0.381 – 1.524)
.125
3.175
MIN
.100
(2.54)
BSC
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0° – 15°
.045 – .065
(1.143 – 1.651)
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
.200
(5.080)
MAX
.005
(0.127)
MIN
.405
(10.287)
MAX
.220 – .310
(5.588 – 7.874)
12
3
4
87
65
.025
(0.635)
RAD TYP
NOTE: LEAD DIMENSIONS APPLY TO SOLDER
DIP/PLATE OR TIN PLATE LEADS
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
SW Package
16-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
OBSOLETE PACKAGE
S16 (WIDE) 0502
NOTE 3
.398 – .413
(10.109 – 10.490)
NOTE 4
16
15
14
13
12
11
10
9
1
N
23
4
5
6
78
N/2
.394 – .419
(10.007 – 10.643)
.037 – .045
(0.940 – 1.143)
.004 – .012
(0.102 – 0.305)
.093 – .104
(2.362 – 2.642)
.050
(1.270)
BSC
.014 – .019
(0.356 – 0.482)
TYP
0° – 8° TYP
NOTE 3
.009 – .013
(0.229 – 0.330)
.005
(0.127)
RAD MIN
.016 – .050
(0.406 – 1.270)
.291 – .299
(7.391 – 7.595)
NOTE 4
× 45°
.010 – .029
(0.254 – 0.737)
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON
TOP AND CAVITIES ON THE
BOTTOM OF PACKAGES
ARE THE MANUFACTURING
OPTIONS. THE PART MAY BE
SUPPLIED WITH OR WITHOUT
ANY OF THE OPTIONS.
4. THESE DIMENSIONS DO NOT
INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT
EXCEED .006" (0.15mm)
.420
MIN
.325 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
N
12
3
N/2
.050 BSC
.030 ±.005
TYP
U
PACKAGE DESCRIPTIO
N8 1002
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.020
(0.508)
MIN
.018 ± .003
(0.457 ± 0.076)
.120
(3.048)
MIN
12
3
4
87
6
5
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
.100
(2.54)
BSC
NOTE:
1. DIMENSIONS
*THESE DIMENSIONS
DO NOT INCLUDE
MOLD FLASH OR
PROTRUSIONS.
MOLD FLASH OR
PROTRUSIONS
SHALL NOT EXCEED
.010 INCH (0.254mm)
INCHES
MILLIMETERS
ARE
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