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11
LTC1164-6
11646fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
U
J Package
14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
N Package
14-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
J16 0801
.015 – .060
(0.380 – 1.520)
.100
(2.54)
BSC
.014 – .026
(0.360 – 0.660)
.045 – .065
(1.143 – 1.651)
.200
(5.080)
MAX
.125
(3.175)
MIN
.008 – .018
(0.203 – 0.457)
0
° – 15°
1
23
4
5
6
78
.220 – .310
(5.588 – 7.874)
.840
(21.336)
MAX
.005
(0.127)
MIN
16
13
9
10
11
12
14
15
.025
(0.635)
RAD TYP
.300 BSC
(7.62 BSC)
.045 – .065
(1.143 – 1.65)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
N14 1103
.020
(0.508)
MIN
.120
(3.048)
MIN
.130
± .005
(3.302
± 0.127)
.045 – .065
(1.143 – 1.651)
.065
(1.651)
TYP
.018
± .003
(0.457
± 0.076)
.005
(0.127)
MIN
.255
± .015*
(6.477
± 0.381)
.770*
(19.558)
MAX
3
1
2
4
5
6
7
8
9
10
11
12
13
14
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
OBSOLETE PACKAGE