參數(shù)資料
型號： LTC1289BCJ
廠商： LINEAR TECHNOLOGY CORP
元件分類： ADC
英文描述： 3 Volt Single Chip 12-Bit Data Acquisition System
中文描述： 8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP20
封裝： 0.300 INCH, CERDIP-20
文件頁數(shù)： 16/28頁
文件大?。?/td> 487K
代理商： LTC1289BCJ
16
LTC1289
U
S
A
O
PPLICATI
IU
U
Figure 6 shows an example of an ideal ground plane design
for a two-sided board. Of course, this much ground plane
will not always be possible, but users should strive to get
as close to this ideal as possible.
2. Bypassing
For good performance, V
CC
must be free of noise and ripple.
Any changes in the V
CC
voltage with respect to analog
ground during a conversion cycle can induce errors or
noise in the output code. V
CC
noise and ripple can be kept
below 0.5mV by bypassing the V
CC
pin directly to the analog
ground plane with a 22
μ
F tantalum capacitor and leads as
short as possible. The lead from the device to the V
CC
supply should also be kept to a minimum and the V
CC
supply should have a low output impedance such as that
obtained from a voltage regulator (e.g., LT1117). Using a
battery to power the LTC1289 will help reduce the amount
of bypass capacitance required on the V
CC
pin. A battery
placed close to the device will only require 10
μ
F to ad-
equately bypass the supply pin. Figure 7 shows the effect of
poor V
CC
bypassing. Figure 8a shows the settling of a
LT1117 low dropout regulator with a 22
μ
F bypass capaci-
tor. The noise and ripple is approximately 0.5mV. Figure 8b
shows the response of a lithium battery with a 10
μ
F bypass
capacitor. The noise and ripple is kept below 0.5mV.
Figure 7. Poor V
CC
Bypassing.
Noise and Ripple Can Cause A/D Errors.
Figure 8a. LT1117 Regulator with 22
μ
F Bypassing on V
CC
HORIZONTAL: 20
μ
s/DIV
5V/DIV
CS
0.5mV/DIV
V
CC
Figure 8b. Lithium Battery with 10
μ
F Bypassing on V
CC
HORIZONTAL: 20
μ
s/DIV
Figure 6. Example Ground Plane for the LTC1289
0.5mV/DIV
5V/DIV
CS
V
CC
V
HORIZONTAL: 10
μ
s/DIV
V
–
0.1μF
CERAMIC
DISK
22
μ
F
TANTALUM
V
CC
LTC1289 AIF06
ANALOG
GROUND
PLANE
0.1
μ
F
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相關PDF資料
PDF描述
LTC1289BIJ 3 Volt Single Chip 12-Bit Data Acquisition System
LTC1289BIN 3 Volt Single Chip 12-Bit Data Acquisition System
LTC1289CIJ 3 Volt Single Chip 12-Bit Data Acquisition System
LTC1289CIN 3 Volt Single Chip 12-Bit Data Acquisition System
LTC1290DISW Single Chip 12-Bit Data Acquisition System
相關代理商/技術參數(shù)
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LTC1289BCN 功能描述:IC DATA ACQ SYS 12BIT 3V 20-DIP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)（DAS） 分辨率（位）:16 b 采樣率（每秒）:21.94k 數(shù)據(jù)接口:MICROWIRE?，QSPI?，串行，SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設備封裝:40-TQFN-EP（6x6） 包裝:托盤
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LTC1289BCSW 功能描述:IC DATA ACQ SYS 12BIT 3V 20-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)（DAS） 分辨率（位）:16 b 采樣率（每秒）:21.94k 數(shù)據(jù)接口:MICROWIRE?，QSPI?，串行，SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設備封裝:40-TQFN-EP（6x6） 包裝:托盤
LTC1289BCSW#PBF 功能描述:IC DATA ACQ SYS 12BIT 3V 20-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)（DAS） 分辨率（位）:16 b 采樣率（每秒）:21.94k 數(shù)據(jù)接口:MICROWIRE?，QSPI?，串行，SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設備封裝:40-TQFN-EP（6x6） 包裝:托盤
LTC1289BCSW#TR 功能描述:IC DATA ACQ SYS 12BIT 3V 20SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)（DAS） 分辨率（位）:16 b 采樣率（每秒）:21.94k 數(shù)據(jù)接口:MICROWIRE?，QSPI?，串行，SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設備封裝:40-TQFN-EP（6x6） 包裝:托盤
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