參數(shù)資料
型號(hào): LTC1290BIN#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 25/32頁(yè)
文件大小: 0K
描述: IC DATA ACQ SYS 12BIT 20-DIP
標(biāo)準(zhǔn)包裝: 18
類(lèi)型: 數(shù)據(jù)采集系統(tǒng)(DAS),ADC
分辨率(位): 12 b
采樣率(每秒): 50k
數(shù)據(jù)接口: 串行,并聯(lián)
電壓電源: 雙 ±
電源電壓: ±5 V,5 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 通孔
封裝/外殼: 20-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 20-PDIP
包裝: 管件
31
LTC1290
1290fe
SW Package
20-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
PACKAGE DESCRIPTIO
U
S20 (WIDE) 0502
NOTE 3
.496 – .512
(12.598 – 13.005)
NOTE 4
20
N
19
18
17
16
15
14
13
1
23
4
5
6
78
.394 – .419
(10.007 – 10.643)
910
N/2
11
12
.037 – .045
(0.940 – 1.143)
.004 – .012
(0.102 – 0.305)
.093 – .104
(2.362 – 2.642)
.050
(1.270)
BSC
.014 – .019
(0.356 – 0.482)
TYP
0
° – 8° TYP
NOTE 3
.009 – .013
(0.229 – 0.330)
.016 – .050
(0.406 – 1.270)
.291 – .299
(7.391 – 7.595)
NOTE 4
× 45°
.010 – .029
(0.254 – 0.737)
.420
MIN
.325
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
N
12
3
N/2
.050 BSC
.030
±.005
TYP
.005
(0.127)
RAD MIN
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of circuits as described herein will not infringe on existing patent rights.
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LTC1290BISW 功能描述:IC DATA ACQ SYS 12BIT 20-SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專(zhuān)用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 類(lèi)型:數(shù)據(jù)采集系統(tǒng)(DAS) 分辨率(位):16 b 采樣率(每秒):21.94k 數(shù)據(jù)接口:MICROWIRE?,QSPI?,串行,SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:40-TQFN-EP(6x6) 包裝:托盤(pán)
LTC1290BISW#PBF 功能描述:IC DATA ACQ SYS 12BIT 20-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專(zhuān)用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 類(lèi)型:數(shù)據(jù)采集系統(tǒng)(DAS) 分辨率(位):16 b 采樣率(每秒):21.94k 數(shù)據(jù)接口:MICROWIRE?,QSPI?,串行,SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:40-TQFN-EP(6x6) 包裝:托盤(pán)
LTC1290BISW#TR 功能描述:IC DATA ACQ SYS 12BIT 5V 20SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專(zhuān)用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 類(lèi)型:數(shù)據(jù)采集系統(tǒng)(DAS) 分辨率(位):16 b 采樣率(每秒):21.94k 數(shù)據(jù)接口:MICROWIRE?,QSPI?,串行,SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:40-TQFN-EP(6x6) 包裝:托盤(pán)
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