參數(shù)資料
型號: LTC1350IG#TRPBF
廠商: Linear Technology
文件頁數(shù): 7/8頁
文件大?。?/td> 0K
描述: IC TXRX 3.3V EIA/TIA-562 28-SSOP
標準包裝: 2,000
類型: 收發(fā)器
驅(qū)動器/接收器數(shù): 3/5
規(guī)程: RS562
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
封裝/外殼: 28-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 28-SSOP
包裝: 帶卷 (TR)
7
LTC1350
1350fa
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
G Package
28-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
G28 SSOP 0802
0.09 – 0.25
(.0035 – .010)
0° – 8°
0.55 – 0.95
(.022 – .037)
5.00 – 5.60**
(.197 – .221)
7.40 – 8.20
(.291 – .323)
12 3
4
5
6 7 89 10 11 12
14
13
9.90 – 10.50*
(.390 – .413)
25
26
22 21 20 19 18 17 16 15
23
24
27
28
2.0
(.079)
0.05
(.002)
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.42 ±0.03
0.65 BSC
5.3 – 5.7
7.8 – 8.2
RECOMMENDED SOLDER PAD LAYOUT
1.25 ±0.12
NW28 1002
.505 – .560*
(12.827 – 14.224)
1.467*
(36.957)
MAX
12
3
4
5
6
7
8
9
10
27
19
20
21
22
24
23
25
26
28
11
12
13
14
15
16
17
18
.008 – .015
(0.203 – 0.381)
.625
+.035
–.015
+0.889
–0.381
15.87
()
.600 – .625
(15.240 – 15.875)
.070
(1.778)
TYP
.015
(0.381)
MIN
.120
(3.175)
MIN
.150 ± .005
(3.810 ± 0.127)
.018 ± .003
(0.457 ± 0.076)
.035 – .080
(0.889 – 2.032)
.045 – .065
(1.143 – 1.651)
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
NW Package
28-Lead PDIP (Wide .600 Inch)
(Reference LTC DWG # 05-08-1520)
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