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    參數(shù)資料
    型號: LTC2052HVIS#PBF
    廠商: Linear Technology
    文件頁數(shù): 2/12頁
    文件大?。?/td> 0K
    描述: IC OP-AMP ZERO-DRIFT QUAD 14SOIC
    標(biāo)準(zhǔn)包裝: 55
    放大器類型: 斷路器(零漂移)
    電路數(shù): 4
    輸出類型: 滿擺幅
    轉(zhuǎn)換速率: 2 V/µs
    增益帶寬積: 3MHz
    電流 - 輸入偏壓: 90pA
    電壓 - 輸入偏移: 1µV
    電流 - 電源: 1mA
    電壓 - 電源,單路/雙路(±): 2.7 V ~ 12 V,±1.35 V ~ 6 V
    工作溫度: -40°C ~ 125°C
    安裝類型: 表面貼裝
    封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
    供應(yīng)商設(shè)備封裝: 14-SO
    包裝: 管件
    10
    LTC2051/LTC2052
    20512fd
    U
    PACKAGE DESCRIPTIO
    MS8 Package
    8-Lead Plastic MSOP
    (Reference LTC DWG # 05-08-1660)
    MS Package
    10-Lead Plastic MSOP
    (Reference LTC DWG # 05-08-1661)
    MSOP (MS8) 0204
    0.53 ± 0.152
    (.021 ± .006)
    SEATING
    PLANE
    NOTE:
    1. DIMENSIONS IN MILLIMETER/(INCH)
    2. DRAWING NOT TO SCALE
    3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
    MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
    4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
    INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
    5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
    0.18
    (.007)
    0.254
    (.010)
    1.10
    (.043)
    MAX
    0.22 – 0.38
    (.009 – .015)
    TYP
    0.127 ± 0.076
    (.005 ± .003)
    0.86
    (.034)
    REF
    0.65
    (.0256)
    BSC
    0° – 6° TYP
    DETAIL “A”
    GAUGE PLANE
    12
    3
    4
    4.90 ± 0.152
    (.193 ± .006)
    8
    7 6 5
    3.00 ± 0.102
    (.118 ± .004)
    (NOTE 3)
    3.00 ± 0.102
    (.118 ± .004)
    (NOTE 4)
    0.52
    (.0205)
    REF
    5.23
    (.206)
    MIN
    3.20 – 3.45
    (.126 – .136)
    0.889 ± 0.127
    (.035 ± .005)
    RECOMMENDED SOLDER PAD LAYOUT
    0.42 ± 0.038
    (.0165 ± .0015)
    TYP
    0.65
    (.0256)
    BSC
    MSOP (MS) 0603
    0.53 ± 0.152
    (.021 ± .006)
    SEATING
    PLANE
    0.18
    (.007)
    1.10
    (.043)
    MAX
    0.17 – 0.27
    (.007 – .011)
    TYP
    0.127 ± 0.076
    (.005 ± .003)
    0.86
    (.034)
    REF
    0.50
    (.0197)
    BSC
    12 3 45
    4.90 ± 0.152
    (.193 ± .006)
    0.497 ± 0.076
    (.0196 ± .003)
    REF
    8
    9
    10
    7 6
    3.00 ± 0.102
    (.118 ± .004)
    (NOTE 3)
    3.00 ± 0.102
    (.118 ± .004)
    (NOTE 4)
    NOTE:
    1. DIMENSIONS IN MILLIMETER/(INCH)
    2. DRAWING NOT TO SCALE
    3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
    MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
    4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
    INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
    5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
    0.254
    (.010)
    0° – 6° TYP
    DETAIL “A”
    GAUGE PLANE
    5.23
    (.206)
    MIN
    3.20 – 3.45
    (.126 – .136)
    0.889 ± 0.127
    (.035 ± .005)
    RECOMMENDED SOLDER PAD LAYOUT
    0.305 ± 0.038
    (.0120 ± .0015)
    TYP
    0.50
    (.0197)
    BSC
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