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參數(shù)資料
| 型號(hào)： | LTC2053CDD |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Quadruple Bus Buffer Gates With 3-State Outputs 14-TSSOP -40 to 85 |
| 中文描述： | INSTRUMENTATION AMPLIFIER, 20 uV OFFSET-MAX, PDSO8 |
| 封裝： | 3 X 3 MM, 0.80 MM HEIGHT, PLASTIC, DFN-8 |
| 文件頁(yè)數(shù)： | 11/12頁(yè) |
| 文件大?。?/td> | 288K |
| 代理商： | LTC2053CDD |
LTC2053
11
2053fa
PACKAGE DESCRIPTIO
U
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MS8) 0603
0.53
±
0.152
(.021
±
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
1
2
3
4
4.90
±
0.152
(.193
±
.006)
8
7
6 5
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
±
0.038
(.0165
±
.0015)
TYP
0.65
(.0256)
BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
5
2.38
±
0.10
(2 SIDES)
1
4
8
PIN 1
TOP MARK
0.200 REF
0.00 – 0.05
(DD8) DFN 0203
0.28
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.5
±
0.05
PACKAGE
OUTLINE
0.28
±
0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698)
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