參數(shù)資料
型號(hào)： LTC2206CUK-14#TRPBF
廠商： Linear Technology
文件頁(yè)數(shù)： 25/32頁(yè)
文件大小： 0K
描述： IC ADC 14-BIT 80MSPS 48-QFN
標(biāo)準(zhǔn)包裝： 2,000
位數(shù)： 14
采樣率（每秒）： 80M
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 875mW
電壓電源： 單電源
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 48-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 48-QFN-EP（7x7）
包裝： 帶卷 (TR)
輸入數(shù)目和類型： 1 個(gè)差分
配用： DC890B-ND - BOARD USB DATA COLLECTION
LTC2207-14/LTC2206-14
31
220714614fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
UK Package
48-Lead Plastic QFN (7mm
× 7mm)
(Reference LTC DWG # 05-08-1704 Rev C)
7.00
0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1
CHAMFER
C = 0.35
0.40
0.10
48
47
1
2
BOTTOM VIEW—EXPOSED PAD
5.50 REF
(4-SIDES)
0.75
0.05
R = 0.115
TYP
0.25
0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UK48) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
0.05
5.50 REF
(4 SIDES)
6.10
0.05 7.50
0.05
0.25
0.05
0.50 BSC
PACKAGE OUTLINE
5.15
0.10
5.15
0.10
5.15
0.05
5.15
0.05
R = 0.10
TYP
PACKAGE DESCRIPTION
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