Please refer to
參數(shù)資料
型號: LTC2259IUJ-12#TRPBF
廠商: Linear Technology
文件頁數(shù): 26/34頁
文件大?。?/td> 0K
描述: IC ADC 12BIT 80MSPS 40-QFN
產(chǎn)品培訓模塊: LTC2262 - Ultra Low Power High Speed ADCs
標準包裝: 2,000
位數(shù): 12
采樣率(每秒): 80M
數(shù)據(jù)接口: 并聯(lián),串行,SPI
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 102mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 40-WFQFN 裸露焊盤
供應商設備封裝: 40-QFN(6x6)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個差分
配用: DC890B-ND - BOARD USB DATA COLLECTION
LTC2261-12
LTC2260-12/LTC2259-12
32
226112fc
For more information www.linear.com/LTC2261-12
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
6.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.45 OR
0.35
× 45°
CHAMFER
0.40 ±0.10
40
39
1
2
BOTTOM VIEW—EXPOSED PAD
4.50 REF
(4-SIDES)
4.42 ±0.10
4.42 ±0.05
0.75 ±0.05
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UJ40) QFN REV 0406
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
4.50 ±0.05
(4 SIDES)
5.10 ±0.05
6.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
R = 0.10
TYP
UJ Package
40-Lead Plastic QFN (6mm
× 6mm)
(Reference LTC DWG # 05-08-1728 Rev )
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