參數(shù)資料
型號(hào)： LTC2611CDD
廠商： LINEAR TECHNOLOGY CORP
元件分類： DAC
英文描述： 16-/14-/12-Bit Rail-to-Rail DACs in 10-Lead DFN
中文描述： SERIAL INPUT LOADING, 9 us SETTLING TIME, 14-BIT DAC, PDSO10
封裝： 3 X 3 MM, PLASTIC, MO-229WEED-2, DFN-10
文件頁(yè)數(shù)： 15/16頁(yè)
文件大小： 321K
代理商： LTC2611CDD
15
LTC2601/LTC2611/LTC2621
2601f
Figure 3. Effects of Rail-to-Rail Operation On the DAC Transfer Curve. (a) Overall Transfer Function (b) Effect
of Negative Offset for Codes Near Zero Scale (c) Effect of Positive Full-Scale Error for Codes Near Full Scale
OPERATIOU
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
2601 F03
INPUT CODE
(b)
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
0V
32, 768
INPUT CODE
(a)
0
65, 535
OUTPUT
VOLTAGE
V
REF
= V
CC
V
REF
= V
CC
(c)
INPUT CODE
OUTPUT
VOLTAGE
POSITIVE
FSE
U
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1699)
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
2.38
±
0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD10) DFN 1103
0.25
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.50
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
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LTC2611CDD#PBF 功能描述:IC DAC 14BIT SGL R-R VOUT 10DFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals DAC Architectures 設(shè)計(jì)資源:Unipolar, Precision DC Digital-to-Analog Conversion using AD5450/1/2/3 8-14-Bit DACs (CN0052) Precision, Bipolar, Configuration for AD5450/1/2/3 8-14bit Multiplying DACs (CN0053) AC Signal Processing Using AD5450/1/2/3 Current Output DACs (CN0054) Programmable Gain Element Using AD5450/1/2/3 Current Output DAC Family (CN0055) Single Supply Low Noise LED Current Source Driver Using a Current Output DAC in the Reverse Mode (CN0139) 標(biāo)準(zhǔn)包裝:10,000 系列:- 設(shè)置時(shí)間:- 位數(shù):12 數(shù)據(jù)接口:DSP，MICROWIRE?，QSPI?，串行，SPI? 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-8 薄型，TSOT-23-8 供應(yīng)商設(shè)備封裝:TSOT-23-8 包裝:帶卷 (TR) 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:2.7M
LTC2611CDD#TR 功能描述:IC DAC 14BIT SGL R-R VOUT 10DFN RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals DAC Architectures 設(shè)計(jì)資源:Unipolar, Precision DC Digital-to-Analog Conversion using AD5450/1/2/3 8-14-Bit DACs (CN0052) Precision, Bipolar, Configuration for AD5450/1/2/3 8-14bit Multiplying DACs (CN0053) AC Signal Processing Using AD5450/1/2/3 Current Output DACs (CN0054) Programmable Gain Element Using AD5450/1/2/3 Current Output DAC Family (CN0055) Single Supply Low Noise LED Current Source Driver Using a Current Output DAC in the Reverse Mode (CN0139) 標(biāo)準(zhǔn)包裝:10,000 系列:- 設(shè)置時(shí)間:- 位數(shù):12 數(shù)據(jù)接口:DSP，MICROWIRE?，QSPI?，串行，SPI? 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-8 薄型，TSOT-23-8 供應(yīng)商設(shè)備封裝:TSOT-23-8 包裝:帶卷 (TR) 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:2.7M
LTC2611CDD#TRPBF 功能描述:IC DAC 14BIT SGL R-R VOUT 10DFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:*
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