參數(shù)資料
型號: LTC2641CS8-16#PBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: DAC
英文描述: 16-BIT DAC, PDSO8
封裝: LEAD FREE, PLASTIC, MSOP-8
文件頁數(shù): 11/24頁
文件大?。?/td> 334K
代理商: LTC2641CS8-16#PBF
LTC2641/LTC2642
19
26412fb
PACKAGE DESCRIPTION
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
APPLICATIONS INFORMATION
on the digital inputs is imperceptible, thanks to the digital
input hysteresis)
Just by maintaining separate areas on the GND plane
where analog and digital return currents naturally ow,
good results are generally achieved. Only after this has
been done, it is sometimes useful to interrupt the ground
plane with strategically placed “slots”, to prevent the digital
ground currents from fringing into the analog portion of
the plane. When doing this, the gap in the plane should be
only as long as it needs to be to serve its purpose.
Caution: if a GND plane gap is improperly placed, so that
it interrupts a signicant GND return path, or if a signal
traces crosses over the gap, then adding the gap may
greatly degrade performance! In this case, the GND and
signal return currents are forced to ow the long way
around the gap, and then are typically channeled directly
into the most sensitive area of the analog GND plane.
相關PDF資料
PDF描述
LTC2641CS8-16#TRPBF 16-BIT DAC, PDSO8
LTC2752AILX#PBF 16-BIT DAC, PQFP48
LTC2752ACLX#PBF 16-BIT DAC, PQFP48
LTC2752BCLX#PBF 16-BIT DAC, PQFP48
LTC2752BILX#PBF 16-BIT DAC, PQFP48
相關代理商/技術參數(shù)
參數(shù)描述
LTC2641IDD-12#PBF 功能描述:IC DAC 12BIT VOUT 8-DFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 產品培訓模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標準包裝:91 系列:- 設置時間:4µs 位數(shù):10 數(shù)據接口:MICROWIRE?,串行,SPI? 轉換器數(shù)目:8 電壓電源:單電源 功率耗散(最大):2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應商設備封裝:14-DFN-EP(4x3) 包裝:管件 輸出數(shù)目和類型:8 電壓,單極 采樣率(每秒):*
LTC2641IDD-12#TRPBF 功能描述:IC DAC 12BIT VOUT 8-DFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 產品培訓模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標準包裝:91 系列:- 設置時間:4µs 位數(shù):10 數(shù)據接口:MICROWIRE?,串行,SPI? 轉換器數(shù)目:8 電壓電源:單電源 功率耗散(最大):2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應商設備封裝:14-DFN-EP(4x3) 包裝:管件 輸出數(shù)目和類型:8 電壓,單極 采樣率(每秒):*
LTC2641IDD-14#PBF 功能描述:IC DAC 14BIT VOUT 8-DFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 標準包裝:1 系列:- 設置時間:4.5µs 位數(shù):12 數(shù)據接口:串行,SPI? 轉換器數(shù)目:1 電壓電源:單電源 功率耗散(最大):- 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應商設備封裝:8-SOICN 包裝:剪切帶 (CT) 輸出數(shù)目和類型:1 電壓,單極;1 電壓,雙極 采樣率(每秒):* 其它名稱:MCP4921T-E/SNCTMCP4921T-E/SNRCTMCP4921T-E/SNRCT-ND
LTC2641IDD-14#TRPBF 功能描述:IC DAC 14BIT VOUT 8-DFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 標準包裝:47 系列:- 設置時間:2µs 位數(shù):14 數(shù)據接口:并聯(lián) 轉換器數(shù)目:1 電壓電源:單電源 功率耗散(最大):55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP(0.209",5.30mm 寬) 供應商設備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流,單極;1 電流,雙極 采樣率(每秒):*
LTC2641IDD-16#PBF 功能描述:IC DAC 16BIT VOUT 8-DFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 標準包裝:47 系列:- 設置時間:2µs 位數(shù):14 數(shù)據接口:并聯(lián) 轉換器數(shù)目:1 電壓電源:單電源 功率耗散(最大):55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP(0.209",5.30mm 寬) 供應商設備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流,單極;1 電流,雙極 采樣率(每秒):*