Supply Voltage (VCC) ......." />
參數(shù)資料
型號: LTC2851HMS8#PBF
廠商: Linear Technology
文件頁數(shù): 11/18頁
文件大小: 0K
描述: IC TXRX RS485 20MBPS 8MSOP
標(biāo)準(zhǔn)包裝: 50
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RS422,RS485
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 管件
LTC2850/LTC2851/LTC2852
285012fd
absoluTe MaxiMuM raTings
Supply Voltage (VCC) ................................... –0.3V to 7V
Logic Input Voltages (RE, DE, DI) ................ –0.3V to 7V
Interface I/O:
A, B, Y, Z.......................................(VCC – 15V) to 15V
Receiver Output Voltage (RO) .......–0.3V to (VCC + 0.3V)
(Note 1)
pin conFiguraTion
Operating Temperature (Note 4)
LTC285xC ................................................ 0°C to 70°C
LTC285xI .............................................–40°C to 85°C
LTC285xH .......................................... –40°C to 125°C
LTC285xMP ....................................... –55°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSOP ...............................................................300°C
LTC2850
TOP VIEW
DD PACKAGE
8-LEAD (3mm × 3mm) PLASTIC DFN
5
9
6
7
8
4
3
2
1
RO
RE
DE
DI
VCC
B
A
GND
TJMAX = 150°C, θJA = 43°C/W, θJC = 3°C/W
EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB
1
2
3
4
RO
RE
DE
DI
8
7
6
5
VCC
B
A
GND
TOP VIEW
MS8 PACKAGE
8-LEAD PLASTIC MSOP
TJMAX = 150°C, θJA = 200°C/W, θJC = 40°C/W
1
2
3
4
8
7
6
5
TOP VIEW
VCC
B
A
GND
RO
RE
DE
DI
S8 PACKAGE
8-LEAD PLASTIC SO
TJMAX = 150°C, θJA = 150°C/W, θJC = 39°C/W
LTC2851
TOP VIEW
DD PACKAGE
8-LEAD (3mm × 3mm) PLASTIC DFN
5
6
7
8
4
3
2
1
VCC
RO
DI
GND
A
B
Z
Y
9
TJMAX = 150°C, θJA = 43°C/W, θJC = 3°C/W
EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB
1
2
3
4
VCC
RO
DI
GND
8
7
6
5
A
B
Z
Y
TOP VIEW
MS8 PACKAGE
8-LEAD PLASTIC MSOP
TJMAX = 150°C, θJA = 200°C/W, θJC = 40°C/W
1
2
3
4
8
7
6
5
TOP VIEW
A
B
Z
Y
VCC
RO
DI
GND
S8 PACKAGE
8-LEAD PLASTIC SO
TJMAX = 150°C, θJA = 150°C/W, θJC = 39°C/W
LTC2852
TOP VIEW
DD PACKAGE
10-LEAD (3mm × 3mm) PLASTIC DFN
10
11
9
6
7
8
4
5
3
2
1
VCC
A
B
Z
Y
RO
RE
DE
DI
GND
TJMAX = 150°C, θJA = 43°C/W, θJC = 3°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
1
2
3
4
5
RO
RE
DE
DI
GND
10
9
8
7
6
VCC
A
B
Z
Y
TOP VIEW
MS PACKAGE
10-LEAD PLASTIC MSOP
TJMAX = 150°C, θJA = 120°C/W, θJC = 45°C/W
TOP VIEW
S PACKAGE
14-LEAD PLASTIC SO
1
2
3
4
5
6
7
14
13
12
11
10
9
8
NC
RO
RE
DE
DI
GND
VCC
NC
A
B
Z
Y
NC
TJMAX = 150°C, θJA = 88°C/W, θJC = 37°C/W
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