參數(shù)資料
型號(hào): LTC2855HGN#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 5/16頁(yè)
文件大?。?/td> 0K
描述: IC TXRX RS485/RS422 16-SSOP
標(biāo)準(zhǔn)包裝: 100
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RS422,RS485
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
封裝/外殼: 16-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SSOP
包裝: 管件
LTC2854/LTC2855
13
285455fb
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
Failsafe “0” Application (Idle State = Logic “0”)
285455 TA03
"A"
"B"
A
B
R
D
LTC2854
I1
RO
I2
DI
100kΩ
VCC
TYPICAL APPLICATION
PACKAGE DESCRIPTION
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LTC2855IDE#TRPBF 功能描述:IC TXRX RS485/RS422 12-DFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):3/3 規(guī)程:RS232,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:28-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件
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LTC2855IGN#PBF 功能描述:IC TXRX RS485/RS422 16-SSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:RS-232 & USB Transceiver 標(biāo)準(zhǔn)包裝:2,000 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):1/1 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SSOP(0.209",5.30mm 寬) 供應(yīng)商設(shè)備封裝:16-SSOP 包裝:帶卷 (TR) 其它名稱:296-19849-2
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