參數(shù)資料
型號: LTC2856HDD-1#TRPBF
廠商: Linear Technology
文件頁數(shù): 7/20頁
文件大?。?/td> 0K
描述: IC TXRX RS485/RS422 8-DFN
標準包裝: 2,500
類型: 收發(fā)器
驅(qū)動器/接收器數(shù): 1/1
規(guī)程: RS422,RS485
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 8-WFDFN 裸露焊盤
供應商設備封裝: 8-DFN-EP(3x3)
包裝: 帶卷 (TR)
LTC2856-1/LTC2856-2
LTC2857-1/LTC2857-2
LTC2858-1/LTC2858-2
15
285678ff
For more information www.linear.com/LTC2856-1
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
±0.05
2.38
±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65
±0.05
(2 SIDES)
2.10
±0.05
0.50
BSC
0.70
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
±0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
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