參數(shù)資料
型號: LTC2861CGN#TRPBF
廠商: Linear Technology
文件頁數(shù): 7/18頁
文件大小: 0K
描述: IC TXRX RS485 20MBPS 16-SSOP
標(biāo)準(zhǔn)包裝: 2,500
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RS485
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 16-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SSOP
包裝: 帶卷 (TR)
LTC2859/LTC2861
15
285961fc
4.00
±0.10
(2 SIDES)
3.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.70
±0.10
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
1
6
12
7
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0806 REV D
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20
±0.05
0.70
±0.05
3.60
±0.05
PACKAGE OUTLINE
3.30
±0.10
0.25
±0.05
0.50 BSC
1.70
±0.05
3.30
±0.05
0.50 BSC
0.25
±0.05
DE/UE Package
12-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
packaGe DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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