For more information www.linear.com/LTC2862 DD Package 10" />
參數(shù)資料
型號(hào): LTC2864HS-2#TRPBF
廠商: Linear Technology
文件頁數(shù): 15/26頁
文件大小: 0K
描述: IC TRANSCEIVER RS485 14-SOIC
標(biāo)準(zhǔn)包裝: 2,500
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RS422,RS485
電源電壓: 3 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SO
包裝: 帶卷 (TR)
LTC2862/LTC2863/
LTC2864/LTC2865
22
2862345fc
For more information www.linear.com/LTC2862
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25
± 0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50
BSC
0.70
±0.05
3.55
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
packaGe DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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