參數(shù)資料
型號(hào): LTC2871IUHF#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 29/36頁(yè)
文件大?。?/td> 0K
描述: IC TXRX RS485/RS422 38-QFN
產(chǎn)品培訓(xùn)模塊: LTC2870 and LTC2871 Multi-Protocol Transceivers
標(biāo)準(zhǔn)包裝: 2,500
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 3/3
規(guī)程: RS232,RS422,RS485
電源電壓: 3 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 38-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 38-QFN(5x7)
包裝: 帶卷 (TR)
配用: DC1786A-ND - BOARD DEMO LTC2871
LTC2870/LTC2871
35
28701f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701 Rev C)
5.00
0.10
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
37
1
2
38
BOTTOM VIEW—EXPOSED PAD
5.50 REF
5.15 ± 0.10
7.00
0.10
0.75
0.05
R = 0.125
TYP
R = 0.10
TYP
0.25
0.05
(UH) QFN REF C 1107
0.50 BSC
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 REF
3.15 ± 0.10
0.40 0.10
0.70
0.05
0.50 BSC
5.5 REF
3.00 REF
3.15 ± 0.05
4.10
0.05
5.50
0.05
5.15 ± 0.05
6.10
0.05
7.50
0.05
0.25
0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35
45 CHAMFER
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