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參數(shù)資料
| 型號： | LTC3400 |
| 廠商： | Linear Technology Corporation |
| 英文描述： | 600mA, 1.2MHz Micropower Synchronous Boost Converter in ThinSOT |
| 中文描述： | 600毫安，1.2MHz的微功率同步升壓轉(zhuǎn)換器采用ThinSOT |
| 文件頁數(shù)： | 6/12頁 |
| 文件大?。?/td> | 181K |
| 代理商： | LTC3400 |
LTC3400/LTC3400B
6
3400f
PCB LAYOUT GUIDELINES
The high speed operation of the LTC3400/LTC3400B
demands careful attention to board layout. You will not get
advertised performance with careless layout. Figure 2
shows the recommended component placement. A large
ground pin copper area will help to lower the chip tempera-
ture. A multilayer board with a separate ground plane is
ideal, but not absolutely necessary.
APPLICATIOU
W
U
U
I
I
V
f
D
2
D
OUT MAX
(
P
IN
)
–
–
=
(
)
η
1
where:
η
= estimated efficiency
I
P
= peak current limit value (0.6A)
V
IN
= input (battery) voltage
D = steady-state duty ratio = (V
OUT
– V
IN
)/V
OUT
f = switching frequency (1.2MHz typical)
L = inductance value
The inductor current ripple is typically set for 20% to 40%
of the maximum inductor current (I
P
). High frequency
ferrite core inductor materials reduce frequency depen-
dent power losses compared to cheaper powdered iron
types, improving efficiency. The inductor should have low
ESR (series resistance of the windings) to reduce the I
2
R
power losses, and must be able to handle the peak
inductor current without saturating. Molded chokes and
some chip inductors usually do not have enough core to
support the peak inductor currents of 850mA seen on the
LTC3400/LTC3400B. To minimize radiated noise, use a
toroid, pot core or shielded bobbin inductor. See Table 1
for some suggested components and suppliers.
SW
GND
FB
1
2
3
6
5
4
V
IN
V
OUT
SHDN
SHDN
(OPTIONAL)
3400 F02
V
OUT
V
IN
RECOMMENDED COMPONENT PLACEMENT. TRACES
CARRYING HIGH CURRENT ARE DIRECT. TRACE AREA AT
FB PIN IS SMALL. LEAD LENGTH TO BATTERY IS SHORT
Figure 2. Recommended Component Placement
for Single Layer Board
COMPONENT SELECTION
Inductor Selection
The LTC3400/LTC3400B can utilize small surface mount
and chip inductors due to their fast 1.2MHz switching
frequency. A minimum inductance value of 3.3
μ
H is
necessary for 3.6V and lower voltage applications and
4.7
μ
H for output voltages greater than 3.6V. Larger values
of inductance will allow greater output current capability
by reducing the inductor ripple current. Increasing the
inductance above 10
μ
H will increase size while providing
little improvement in output current capability.
The approximate output current capability of the LTC3400/
LTC3400B versus inductance value is given in the equa-
tion below and illustrated graphically in Figure 3.
INDUCTANCE (
μ
H)
3
60
O
80
110
120
160
7
11 13
21
180
140
5
9
15 17 19
23
3400 F03
V
IN
=1.2V
V
OUT
= 3V
V
OUT
= 3.3V
V
OUT
= 3.6V
V
OUT
= 5V
Figure 3. Maximum Output Current vs
Inductance Based On 90% Efficiency
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| LTC3400/LTC3400B | 制造商:LINER 制造商全稱:Linear Technology 功能描述:4A, 2MHz Dual Phase Step-Up DC/DC Converter in 3mm 3mm DFN |
| LTC3400-1 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:600mA, 1.2MHz Micropower Synchronous Boost Converter in ThinSOT |
| LTC3400B | 制造商:LINER 制造商全稱:Linear Technology 功能描述:1.2MHz Step-Up DC/DC Converter in SOT-23 |
| LTC3400BES6 | 制造商:Linear Technology 功能描述:Conv DC-DC Single Step Up 0.5V to 6V 6-Pin TSOT-23 |
| LTC3400BES6#PBF | 制造商:Linear Technology 功能描述:Conv DC-DC Single Step Up 0.5V to 6V 6-Pin TSOT-23 |
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