參數(shù)資料
型號(hào): LTC3406BES5-1.8
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: 1.5MHz, 600mA Synchronous Step-Down Regulator in ThinSOT
中文描述: 1.25 A SWITCHING REGULATOR, 1800 kHz SWITCHING FREQ-MAX, PDSO5
封裝: PLASTIC, MO-193, TSOT-23, 5 PIN
文件頁數(shù): 10/16頁
文件大小: 231K
代理商: LTC3406BES5-1.8
10
LTC3406B
3406bfa
APPLICATIOU
Although all dissipative elements in the circuit produce
losses, two main sources usually account for most of the
losses in LTC3406B circuits: V
IN
quiescent current and I
2
R
losses. The V
IN
quiescent current loss dominates the
efficiency loss at very low load currents whereas the I
2
R
loss dominates the efficiency loss at medium to high load
currents. In a typical efficiency plot, the efficiency curve at
very low load currents can be misleading since the actual
power lost is of no consequence as illustrated in Figure 4.
W
U
U
2. I
2
R losses are calculated from the resistances of the
internal switches, R
SW
, and external inductor R
L
. In
continuous mode, the average output current flowing
through inductor L is “chopped” between the main
switch and the synchronous switch. Thus, the series
resistance looking into the SW pin is a function of both
top and bottom MOSFET R
DS(ON)
and the duty cycle
(DC) as follows:
R
SW
= (R
DS(ON)TOP
)(DC) + (R
DS(ON)BOT
)(1 – DC)
The R
DS(ON)
for both the top and bottom MOSFETs can
be obtained from the Typical Performance Charateristics
curves. Thus, to obtain I
2
R losses, simply add R
SW
to
R
L
and multiply the result by the square of the average
output current.
Other losses including C
IN
and C
OUT
ESR dissipative
losses and inductor core losses generally account for less
than 2% total additional loss.
Thermal Considerations
In most applications the LTC3406B does not dissipate
much heat due to its high efficiency. But, in applications
where the LTC3406B is running at high ambient tempera-
ture with low supply voltage and high duty cycles, such
as in dropout, the heat dissipated may exceed the maxi-
mum junction temperature of the part. If the junction
temperature reaches approximately 150
°
C, both power
switches will be turned off and the SW node will become
high impedance.
To avoid the LTC3406B from exceeding the maximum
junction temperature, the user will need to do some
thermal analysis. The goal of the thermal analysis is to
determine whether the power dissipated exceeds the
maximum junction temperature of the part. The tempera-
ture rise is given by:
T
R
= (P
D
)(
θ
JA
)
where P
D
is the power dissipated by the regulator and
θ
JA
is the thermal resistance from the junction of the die to the
ambient temperature.
Figure 4. Power Lost vs Load Current
1. The V
IN
quiescent current is due to two components:
the DC bias current as given in the electrical character-
istics and the internal main switch and synchronous
switch gate charge currents. The gate charge current
results from switching the gate capacitance of the
internal power MOSFET switches. Each time the gate is
switched from high to low to high again, a packet of
charge, dQ, moves from V
IN
to ground. The resulting
dQ/dt is the current out of V
IN
that is typically larger than
the DC bias current. In continuous mode, I
GATECHG
=
f(Q
T
+ Q
B
) where Q
T
and Q
B
are the gate charges of the
internal top and bottom switches. Both the DC bias and
gate charge losses are proportional to V
IN
and thus
their effects will be more pronounced at higher supply
voltages.
LOAD CURRENT (mA)
P
0.1
10
100
1000
3406B F04
1
1
0.1
0.01
0.001
0.0001
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 1.5V
VIN = 3.6V
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