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參數(shù)資料
| 型號： | LTC4441IMSE |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | MOSFETs |
| 英文描述： | RV Series - Econoline Unregulated DC-DC Converters; Input Voltage (Vdc): 15V; Output Voltage (Vdc): 3.3V; Power: 2W; High Isolation 2W Converter; Approved for Medical Applications; EN and UL Safety Certificates; 6kVDC Isolation; Skinny DIP24 Package; Optional Continuous Short Circuit Protected; Fully Encapsulated; Very Low Isolation Capacitance |
| 中文描述： | 6 A BUF OR INV BASED MOSFET DRIVER, PDSO10 |
| 封裝： | PLASTIC, MSOP-10 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 154K |
| 代理商： | LTC4441IMSE |
11
44411f
LTC4441/LTC4441-1
check with power MOSFET manufacturers for their
innovations on low Q
G
, low R
DS(ON)
devices. Power
MOSFET manufacturing technologies are continually im-
proving, with newer and better performing devices being
introduced.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC4441/LTC4441-1:
A. Mount the bypass capacitors as close as possible
between the DRV
CC
and PGND pins and between the V
IN
and SGND pins. The PCB trace loop areas should be
tightened as much as possible to reduce inductance.
B. Use a low inductance, low impedance ground plane to
reduce any ground drop. Remember that the LTC4441/
LTC4441-1 switches 6A peak current and any significant
ground drop will degrade signal integrity.
APPLICATIU
W
U
U
C. Keep the PCB ground trace between the LTC4441/
LTC4441-1 ground pins (PGND and SGND) and the exter-
nal current sense resistor as short and wide as possible.
D. Plan the ground routing carefully. Know where the large
load switching current paths are. Maintain separate ground
return paths for the input pin and output pin to avoid
sharing small-signal ground with large load ground re-
turn. Terminate these two ground traces only at the GND
pin of the driver (STAR network).
E. Keep the copper trace between the driver output pin and
the load short and wide.
F. Place the small-signal components away from the high
frequency switching nodes. These components include
the resistive networks connected to the FB, RBLANK and
EN/SHDN pins.
U
PACKAGE DESCRIPTIO
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1663)
MSOP (MSE) 0603
0.53
±
0.152
(.021
±
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
10
1
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
±
0.038
(.0120
±
.0015)
TYP
2.083
±
0.102
(.082
±
.004)
2.794
±
0.102
(.110
±
.004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
±
0.102
(.072
±
.004)
2.06
±
0.102
(.081
±
.004)
1 2 3 4 5
4.90
±
0.152
(.193
±
.006)
0.497
±
0.076
(.0196
±
.003)
REF
8
9
10
7 6
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
(NOTE 4)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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