參數(shù)資料
型號(hào): LTC6082IGN#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 8/20頁(yè)
文件大?。?/td> 0K
描述: IC AMP R-R QUAD I/O 16-SSOP
標(biāo)準(zhǔn)包裝: 100
放大器類型: 通用
電路數(shù): 4
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1 V/µs
增益帶寬積: 3.5MHz
電流 - 輸入偏壓: 0.2pA
電壓 - 輸入偏移: 70µV
電流 - 電源: 340µA
電流 - 輸出 / 通道: 24mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SSOP
包裝: 管件
LTC6081/LTC6082
16
60812fd
For more information www.linear.com/LTC6081
packaGe DescripTion
3.00
±0.10
(2 SIDES)
5.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.20
TYP
4.40
±0.10
(2 SIDES)
1
8
16
9
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DHC16) DFN 1103
0.25
±0.05
PIN 1
NOTCH
0.50 BSC
4.40
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.20
±0.05
0.50 BSC
0.65
±0.05
3.50
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
DHC Package
16-Lead Plastic DFN (5mm
× 3mm)
(Reference LTC DWG # 05-08-1706 Rev )
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
相關(guān)PDF資料
PDF描述
929647-04-26-I CONN HEADER .100 SNGL STR 26POS
LTC6082HGN#PBF IC AMP R-R QUAD I/O 16-SSOP
TSW-136-23-G-D CONN HEADER 72POS .100" DL GOLD
77311-818-10LF CONN HEADER .100 SINGL STR 10POS
GTCR36-151M-R10 GAS TUBE 6MM 150V 20% RAD 10KA
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