參數(shù)資料
型號(hào): LTC6084HMS8#PBF
廠商: Linear Technology
文件頁數(shù): 7/16頁
文件大?。?/td> 0K
描述: IC AMP R-R CMOS DUAL 8-MSOP
標(biāo)準(zhǔn)包裝: 50
放大器類型: 通用
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.5 V/µs
增益帶寬積: 1.5MHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 300µV
電流 - 電源: 110µA
電流 - 輸出 / 通道: 12.5mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 管件
產(chǎn)品目錄頁面: 1322 (CN2011-ZH PDF)
LTC6084/LTC6085
15
60845fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MS8) 0307 REV F
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
± 0.0508
(.004
± .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
12 3 4
4.90
± 0.152
(.193
± .006)
8 7 6 5
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
± 0.038
(.0165
± .0015)
TYP
0.65
(.0256)
BSC
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
GN16 (SSOP) 0204
12 3 4
5 6 7 8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015
± .004
(0.38
± 0.10)
× 45°
0
° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165
±.0015
.045
±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
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