Please refer to http://www.linear.com/designtools/packaging/
參數(shù)資料
型號(hào)： LTC6088HGN#TRPBF
廠商： Linear Technology
文件頁(yè)數(shù)： 4/16頁(yè)
文件大小： 0K
描述： IC AMP QUAD CMOS R-R 16-SSOP
標(biāo)準(zhǔn)包裝： 2,500
放大器類型： 通用
電路數(shù)： 4
輸出類型： 滿擺幅
轉(zhuǎn)換速率： 7.2 V/µs
增益帶寬積： 14MHz
電流 - 輸入偏壓： 1pA
電壓 - 輸入偏移： 330µV
電流 - 電源： 1.05mA
電流 - 輸出 / 通道： 45mA
電壓 - 電源，單路/雙路(±)： 2.7 V ~ 5.5 V
工作溫度： -40°C ~ 125°C
安裝類型： 表面貼裝
封裝/外殼： 16-SSOP（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 16-SSOP
包裝： 帶卷 (TR)
LTC6087/LTC6088
12
60878fc
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25
±0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50
BSC
0.70
±0.05
3.55
±0.05
PACKAGE
OUTLINE
0.25
±0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
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