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參數(shù)資料
| 型號： | LTC6102HDD-1#PBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 17/26頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP CURRENT SENSE 8-DFN |
| 標準包裝： | 121 |
| 放大器類型： | 電流檢測 |
| 電路數(shù)： | 1 |
| 增益帶寬積： | 200kHz |
| 電流 - 輸入偏壓： | 60pA |
| 電壓 - 輸入偏移： | 3µV |
| 電流 - 電源： | 420µA |
| 電流 - 輸出 / 通道： | 1mA |
| 電壓 - 電源，單路/雙路(±)： | 4 V ~ 60 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFDFN 裸露焊盤 |
| 供應商設備封裝： | 8-DFN-EP（3x3） |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 1322 (CN2011-ZH PDF) |
LTC6102
LTC6102-1/LTC6102HV
24
6102fd
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 ± 0.05
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ±0.05
(2 SIDES)
2.10 ±0.05
0.50
BSC
0.70 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LTC6102HDD-PBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
| LTC6102HDD-TR | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
| LTC6102HDD-TRPBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
| LTC6102HMS#PBF | 制造商:Linear Technology 功能描述:AMP CURRENT SENSE PRECISION SMD |
| LTC6102HMS8 | 制造商:Linear Technology 功能描述:SP Amp Current Sense Amp Single 60V 8-Pin MSOP |
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