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參數(shù)資料
| 型號： | LTC6102HVIDD#TR |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO8 |
| 封裝： | 3 X 3 MM, PLASTIC, MO-229WEED-1, DFN-8 |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 277K |
| 代理商： | LTC6102HVIDD#TR |
LTC6102
LTC6102-1/LTC6102HV
23
6102fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.115
TYP
2.38 0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25
0.05
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
2.15 0.05
0.50
BSC
0.675 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LTC6102HVIDD-TRPBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
| LTC6102HVIMS8#PBF | 功能描述:IC AMP CURRENT SENSE 8-MSOP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:1 系列:MicroAmplifier™ 放大器類型:通用 電路數(shù):4 輸出類型:- 轉換速率:3.5 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:5pA 電壓 - 輸入偏移:1500µV 電流 - 電源:220µA 電流 - 輸出 / 通道:60mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 36 V，±2.25 V ~ 18 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:14-SOIC 包裝:剪切帶 (CT) 其它名稱:296-29363-1 |
| LTC6102HVIMS8#TRPBF | 功能描述:IC AMP CURRENT SENSE 8-MSOP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 放大器類型:電流檢測 電路數(shù):1 輸出類型:- 轉換速率:- 增益帶寬積:125kHz -3db帶寬:- 電流 - 輸入偏壓:- 電壓 - 輸入偏移:100µV 電流 - 電源:1.1µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:4-WFBGA，CSPBGA 供應商設備封裝:4-UCSP（2x2） 包裝:剪切帶 (CT) 其它名稱:MAX9634WERS+TCT |
| LTC6102HVIMS8-PBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
| LTC6102HVIMS8-TRPBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
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