參數(shù)資料
型號: LTC6257IMS#TRPBF
廠商: Linear Technology
文件頁數(shù): 15/24頁
文件大?。?/td> 0K
描述: IC OPAMP QUAD 6.5MHZ 16MSOP
標準包裝: 2,500
放大器類型: 通用
電路數(shù): 4
輸出類型: 滿擺幅
轉換速率: 1.8 V/µs
增益帶寬積: 6.5MHz
-3db帶寬: 4.5MHz
電流 - 輸入偏壓: 5nA
電壓 - 輸入偏移: 100µV
電流 - 電源: 65µA
電流 - 輸出 / 通道: 35mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.25 V,±0.9 V ~ 2.625 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-TFSOP(0.118",3.00mm 寬)
供應商設備封裝: 16-MSOP
包裝: 帶卷 (TR)
LTC6255/LTC6256/LTC6257
22
625567fb
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev )
MSOP (MS16) 1107 REV
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16151413121110
1 2 3 4 5 6 7 8
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
± 0.038
(.0120
± .0015)
TYP
0.50
(.0197)
BSC
4.039
± 0.102
(.159
± .004)
(NOTE 3)
0.1016
± 0.0508
(.004
± .002)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.280
± 0.076
(.011
± .003)
REF
4.90
± 0.152
(.193
± .006)
pAckAge Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
相關PDF資料
PDF描述
SSQ-149-03-T-S CONN RCPT .100" 49POS SNGL TIN
TSW-125-08-G-D-RA CONN HEADER 50POS .100 DL R/A AU
LT6600CDF-2.5#PBF IC AMP DIFF LN 12-DFN
LT6600CDF-10#PBF IC AMP DIFF LN 12-DFN
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