參數(shù)資料
型號(hào): LTC6405IMS8E#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 17/26頁(yè)
文件大小: 0K
描述: IC AMP/DVR DIFF R-R 5V 8-MSOP
標(biāo)準(zhǔn)包裝: 2,500
類型: ADC 驅(qū)動(dòng)器
應(yīng)用: 數(shù)據(jù)采集
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)裸露焊盤
供應(yīng)商設(shè)備封裝: 8-MSOP-EP
包裝: 帶卷 (TR)
LTC6405
24
6405fb
For more information www.linear.com/6405
3.00
±0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45
±0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.45
± 0.10
(4-SIDES)
0.75
±0.05
R = 0.115
TYP
0.25
±0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25
× 45° CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10
±0.05
3.50
±0.05
0.70
±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
UD Package
16-Lead Plastic QFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1691 Rev )
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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