參數(shù)資料
型號: LTC6915IDE#PBF
廠商: Linear Technology
文件頁數(shù): 8/18頁
文件大?。?/td> 0K
描述: IC PGA DIGITAL PREC 0DRFT 12DFN
標(biāo)準(zhǔn)包裝: 91
放大器類型: 儀表
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.2 V/µs
增益帶寬積: 200kHz
電流 - 輸入偏壓: 4nA
電壓 - 輸入偏移: 5µV
電流 - 電源: 1.73mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 11 V,±1.35 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 12-WFDFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 12-DFN-EP(4x3)
包裝: 管件
LTC6915
16
6915fb
package DescripTion
Typical applicaTion
Figure 6. A 2:1 Multiplexing Two LTC6915’s
with Daisy Chained Gain Control
Multiplexing Two LTC6915’s
Send a gain code of 0000 to one IC to set its output to a
highimpedancestateandsendagaincodeotherthan0000
to the second IC to set it for normal amplification. If both
devices are ON, the 200Ω resistors protect the outputs.
The sense pin connection maintains gain accuracy for
loads 1k or greater.
SHDN
IN
IN+
V
HOLD_THRU
CS
DIN
CLK
V+
OUT
SENSE
REF
NC
PAR_SER
DGND
DOUT
LTC6915
#1
–5V
P
(TTL
LEVELS)
DATA
SELECT
CLOCK
0.1F
5V
VIN1
SHDN
IN
IN+
V
HOLD_THRU
CS
DIN
CLK
V+
OUT
SENSE
REF
NC
PAR_SER
DGND
DOUT
LTC6915
#2
–5V
0.1F
5V
VIN2
VOUT
200
6915 F06
4.00
±0.10
(2 SIDES)
3.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70
± 0.10
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
1
6
12
7
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0806 REV D
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20
±0.05
0.70
±0.05
3.60
±0.05
PACKAGE
OUTLINE
3.30
±0.10
0.25
± 0.05
0.50 BSC
1.70
± 0.05
3.30
±0.05
0.50 BSC
0.25
± 0.05
GN16 (SSOP) 0204
1 2 3 4 5 6 7 8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015 ±.004
(0.38 ±0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165 ±.0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
DE/UE Package
12-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
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